公开(公告)号：KR1020140104676A

公开(公告)日：2014-08-29

申请号：KR1020130018426

申请日：2013-02-21

Applicant: (주)파트론

Inventor： 박지홍 ,  전완희

IPC: H05K1/14 ,  H01L23/12

CPC classification number: H01L23/12 ,  H01L21/52 ,  H01L23/28 ,  H01L24/11 ,  H05K1/14

Abstract: The present invention relates to a printed circuit board structure in which a plurality of printed circuit boards is bonded and a manufacturing method thereof. The structure with a wide area for mounting an element has a low manufacturing coast and a simple manufacturing process and ensures a high reliability. The printed circuit board structure according to the present invention comprises a first circuit board; a second circuit board which forms a cavity as the upper surface of the second circuit board is partially bonded to the lower surface of the first circuit board and which has at least one pad on the lower surface; a plurality of elements which is mounted on the upper surface of the first circuit board and in the cavity; filler which is filled between the first circuit board and the second circuit board; and a molding member which seals the element mounted on the upper surface of the first circuit board.

Abstract translation: 本发明涉及一种其中多个印刷电路板被接合的印刷电路板结构及其制造方法。 具有用于安装元件的广泛区域的结构具有低制造海岸和简单的制造工艺，并且确保高可靠性。 根据本发明的印刷电路板结构包括第一电路板; 形成第二电路板的上表面的空腔的第二电路板部分地接合到第一电路板的下表面，并且在下表面上具有至少一个焊盘; 多个元件，其安装在第一电路板的上表面和空腔中; 填充物填充在第一电路板和第二电路板之间; 以及密封安装在第一电路板的上表面上的元件的模制构件。