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公开(公告)号：CN1700458A
公开(公告)日：2005-11-23
申请号：CN200510066799.5
申请日：2005-04-29
Applicant: 三星电子株式会社
IPC: H01L23/48 , H01L23/495 , H01L21/50
CPC classification number: H01L23/50 , H01L21/563 , H01L23/3128 , H01L23/49575 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16265 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48482 , H01L2224/48499 , H01L2224/48599 , H01L2224/48799 , H01L2224/49175 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81801 , H01L2224/85051 , H01L2225/0651 , H01L2225/06513 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/00 , H01L2924/00012
Abstract: 在一实施例中，半导体封装包括基构架和电连接于基构架的下半导体芯片。下半导体芯片具有在其顶表面上的第一键合焊盘。该封装还包括在下半导体芯片上放置的上半导体芯片。上半导体芯片具有在其底表面上形成的第三键合焊盘。该封装包括共同地连接第一键合焊盘和第三键合焊盘的第一导电凸点和第二导电凸点。
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公开(公告)号：CN1734759A
公开(公告)日：2006-02-15
申请号：CN200510087416.2
申请日：2005-07-22
Applicant: 三星电子株式会社
IPC: H01L23/495 , H01L21/60
CPC classification number: H01L23/3107 , H01L23/3128 , H01L23/4951 , H01L23/49541 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06179 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48237 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2224/85205 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15724 , H01L2924/15738 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/78 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明公开了一种引线框架基和衬底基半导体封装键合结构及其制备方法。在用于半导体器件封装的键合结构中，其中键合引线的键合角维持在可接受的限度内，而不会导致芯片管芯尺寸的增加。以这种方式，相邻键合引线之间的短路出现将减少或消除，在制造过程中的器件净管芯计数可得到增加。
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Patent Agency Ranking
公开(公告)号：CN100501983C
公开(公告)日：2009-06-17
申请号：CN200510067235.3
申请日：2005-04-20
Applicant: 三星电子株式会社
CPC classification number: H05K3/222 , H01L23/49805 , H01L23/49838 , H01L23/5385 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/05571 , H01L2224/05573 , H01L2224/451 , H01L2224/48227 , H01L2924/00014 , H01L2924/07802 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H05K1/147 , H05K3/361 , H05K2201/10492 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: 一种半导体芯片封装，可包括其上形成有结合垫的衬底。安装在衬底上的半导体芯片具有芯片垫，以及用于将半导体芯片的芯片垫连接到衬底结合垫上的电连接。衬底上的半导体芯片和电连接可被封装起来，接合在衬底部分表面上的板可不被封装。
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公开(公告)号：CN100565865C
公开(公告)日：2009-12-02
申请号：CN200510087416.2
申请日：2005-07-22
Applicant: 三星电子株式会社
IPC: H01L23/495 , H01L21/60
CPC classification number: H01L23/3107 , H01L23/3128 , H01L23/4951 , H01L23/49541 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06179 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48237 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2224/85205 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15724 , H01L2924/15738 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/78 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明公开了一种引线框架基和衬底基半导体封装键合结构及其制备方法。在用于半导体器件封装的键合结构中，其中键合引线的键合角维持在可接受的限度内，而不会导致芯片管芯尺寸的增加。以这种方式，相邻键合引线之间的短路出现将减少或消除，在制造过程中的器件净管芯计数可得到增加。
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公开(公告)号：CN1722412A
公开(公告)日：2006-01-18
申请号：CN200510067782.1
申请日：2005-01-07
Applicant: 三星电子株式会社
CPC classification number: H01L23/49816 , H01L23/3128 , H01L23/49805 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/05548 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06548 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , Y10T307/406 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: 本发明涉及具有更小封装尺寸的封装电路板。该封装电路板包括代替印刷电路板的半导体衬底。该封装电路板还包括安装在半导体衬底上的微电子芯片，该微电子芯片具有形成在半导体衬底上的有源元件和无源元件中的至少一种。
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公开(公告)号：CN100472762C
公开(公告)日：2009-03-25
申请号：CN200510067782.1
申请日：2005-01-07
Applicant: 三星电子株式会社
CPC classification number: H01L23/49816 , H01L23/3128 , H01L23/49805 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/05548 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06548 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , Y10T307/406 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: 本发明涉及具有更小封装尺寸的封装电路板。该封装电路板包括代替印刷电路板的半导体衬底。该封装电路板还包括安装在半导体衬底上的微电子芯片，该微电子芯片具有形成在半导体衬底上的有源元件和无源元件中的至少一种。
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公开(公告)号：CN1700459A
公开(公告)日：2005-11-23
申请号：CN200510067235.3
申请日：2005-04-20
Applicant: 三星电子株式会社
CPC classification number: H05K3/222 , H01L23/49805 , H01L23/49838 , H01L23/5385 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/05571 , H01L2224/05573 , H01L2224/451 , H01L2224/48227 , H01L2924/00014 , H01L2924/07802 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H05K1/147 , H05K3/361 , H05K2201/10492 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: 一种半导体芯片封装，可包括其上形成有结合垫的衬底。安装在衬底上的半导体芯片具有芯片垫，以及用于将半导体芯片的芯片垫连接到衬底结合垫上的电连接。衬底上的半导体芯片和电连接可被封装起来，接合在衬底部分表面上的板可不被封装。
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