公开(公告)号：KR1020040014793A

公开(公告)日：2004-02-18

申请号：KR1020020047532

申请日：2002-08-12

Applicant: 강민석

Inventor： 강민석 ,  박상희

IPC: H05K3/34

CPC classification number: B23K3/082 ,  H05K3/3468

Abstract: PURPOSE: A nozzle structure for an automatic soldering device is provided to stably and securely perform soldering work with respect to various kinds of chips by forming a wave symmetrically to a swirl flow of a solder. CONSTITUTION: A nozzle structure for an automatic soldering device includes a shaft(1), plural assembling pieces(2) coupled to the shaft(1) and a nozzle case(3) surrounding the shaft(1) and the assembling pieces(2). The assembling piece(2) has a hole having a size identical to a sectional area of the shaft(1) such that the assembling piece(2) is assembled with the shaft(1) without using an additional key. The assembling piece(2) is provided at upper and lower portions thereof with a feeding part and a discharging part for feeding or discharging a melting solder, respectively. The nozzle case(3) includes a pipe section(31) having an exhaust port(32) and an elongated hole.

Abstract translation: 目的：提供一种用于自动焊接装置的喷嘴结构，通过与焊料的旋流形成对称的波，来稳定且可靠地对各种芯片进行焊接加工。 构成：用于自动焊接装置的喷嘴结构包括轴（1），与轴（1）连接的多个组装件（2）和围绕轴（1）的喷嘴壳（3）和组装件（2） 。 组装件（2）具有与轴（1）的截面面积相同的孔，使得组装件（2）与轴（1）组装而不使用附加钥匙。 组装件（2）的上部和下部分别设置有用于供给或排出熔化焊料的供给部和排出部。 喷嘴壳体（3）包括具有排气口（32）和长孔的管段（31）。