Bi6Ti5TeO22 유전체 조성물 및 이로 형성되는유전체 박막층을 구비하는 MIM 캐패시터
    1.
    发明公开
    Bi6Ti5TeO22 유전체 조성물 및 이로 형성되는유전체 박막층을 구비하는 MIM 캐패시터 无效
    高K和低损耗电介质薄膜BI6TI5TEO22具有低加工温度的电容器材料

    公开(公告)号:KR1020090070988A

    公开(公告)日:2009-07-01

    申请号:KR1020070139169

    申请日:2007-12-27

    CPC classification number: H01L21/02172 H01L21/02266 H01L27/108

    Abstract: An MIM capacitor employing dielectric thin films is provided to be deposited within a low temperature range from room temperature to 300°C and to show high dielectric constant and low dielectric loss. An MIM capacitor(10) comprises: a bottom electrode layer(120); a dielectric thin film(150) comprising dielectric compositions represented by the formula 1 of Bi6Ti5TeO22; and a top electrode layer(170) patterned so as to overlap with the bottom electrode layer. The dielectric thin film is formed on the bottom electrode layer in 50-300nm thickness. The top electrode layer is formed on the dielectric thin film. The MIM capacitor shows high dielectric constant of 50 or greater and low dielectric loss of 1% or less.

    Abstract translation: 提供使用电介质薄膜的MIM电容器,其在从室温至300℃的低温范围内沉积并显示高介电常数和低介电损耗。 MIM电容器(10)包括:底部电极层(120); 包含由Bi6Ti5TeO22的式1表示的电介质组合物的电介质薄膜(150) 以及图案化以与底部电极层重叠的顶部电极层(170)。 电介质薄膜形成在厚度为50-300nm的底部电极层上。 顶电极层形成在电介质薄膜上。 MIM电容器具有50或更大的高介电常数和1%以下的低介电损耗。

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