Abstract:
An MIM capacitor employing dielectric thin films is provided to be deposited within a low temperature range from room temperature to 300°C and to show high dielectric constant and low dielectric loss. An MIM capacitor(10) comprises: a bottom electrode layer(120); a dielectric thin film(150) comprising dielectric compositions represented by the formula 1 of Bi6Ti5TeO22; and a top electrode layer(170) patterned so as to overlap with the bottom electrode layer. The dielectric thin film is formed on the bottom electrode layer in 50-300nm thickness. The top electrode layer is formed on the dielectric thin film. The MIM capacitor shows high dielectric constant of 50 or greater and low dielectric loss of 1% or less.