公开(公告)号：KR1020090027845A

公开(公告)日：2009-03-18

申请号：KR1020070092978

申请日：2007-09-13

Applicant: 광운대학교 산학협력단 ,  국민대학교산학협력단

Inventor： 김대흠 ,  이동현 ,  임홍재

IPC: C09J163/00 ,  C09J9/02 ,  B82B3/00

CPC classification number: C09J11/00 ,  C08K9/06 ,  C09J9/00 ,  C09J161/06 ,  C09J163/10

Abstract: A preparation method of non-conductive adhesives for chip-stacking is provided to prevent the chip crack and to minimize the degradation of adhesive strength due to low permittivity, heat resistance and small coefficient of thermal expansion by adding nano fumed silica. A preparation method of non-conductive adhesives for chip-stacking containing non-conductive particles of nano size comprises a step for forming thermosetting resin by mixing liquid phenol novolac A type resin 50~70 wt% and semi-solid phenol novolak resin 30~50 wt%, an stirring the resin mixture in organic solvent; a step for mixing the non-conductive particles of nano size that is surface-modified with a silane coupling agent for preventing the aggregation, and methyl ethyl ketone, and mixing the mixture with an imidazole-based curing agent 5 ~ 15 pph per thermosetting resin and epoxy resin; a step for performing ultra sonication for even dispersion; a step for removing impurities from the mixture; and a step for molding the mixture in a film shape.

Abstract translation: 提供了用于芯片堆叠的非导电粘合剂的制备方法，以防止芯片裂纹，并且通过加入纳米热解法二氧化硅，由于低介电常数，耐热性和小的热膨胀系数导致的粘合强度的降低最小化。 包含纳米尺寸的非导电颗粒的芯片堆叠的非导电粘合剂的制备方法包括通过混合液体苯酚酚醛清漆A型树脂50〜70重量％和半固体苯酚酚醛清漆树脂30〜50来形成热固性树脂的步骤 在有机溶剂中搅拌树脂混合物; 将表面改性的纳米尺寸的非导电颗粒与用于防止聚集的硅烷偶联剂混合的步骤和甲基乙基酮，并将混合物与咪唑类固化剂混合5〜15pph /热固性树脂 和环氧树脂; 执行超声处理以均匀分散的步骤; 从混合物中除去杂质的步骤; 以及将该混合物成型为薄膜状的步骤。