公开(公告)号：KR101202329B1

公开(公告)日：2012-11-16

申请号：KR1020110049937

申请日：2011-05-26

Applicant: 국방과학연구소

Inventor： 홍영표 ,  육종관 ,  박의영 ,  장진상

IPC: H01P5/04

CPC classification number: H01P5/04 ,  H01P5/12 ,  H01P5/16

Abstract: PURPOSE: A power combiner/divider substrate and a power combiner/divider are provided to easily install a varactor by forming a hole of a dielectric layer which is smaller than that of a metal surface. CONSTITUTION: A first metal surface(111), a dielectric layer(113), and a second metal surface(115) are sequentially laminated on the substrate. A connector hole(130) is formed in order to insert a connector on a plurality of first positions. The diameter of a hole of the first metal surface of the connector hole and the second metal surface are bigger than that of a hole of the dielectric layer. A through hole(150) is formed at a plurality of second positions. An inner wall of the through hole is coated with metal in order to connect the first metal surface and the second metal surface.

Abstract translation: 目的：提供功率组合器/分压器基板和功率合成器/分压器，以通过形成比金属​​表面小的电介质层的孔来容易地安装变容二极管。 构成：第一金属表面（111），电介质层（113）和第二金属表面（115）依次层压在基板上。 形成连接孔（130）以将连接器插入多个第一位置。 连接器孔和第二金属表面的第一金属表面的孔的直径大于介电层的孔的直径。 在多个第二位置形成通孔（150）。 为了连接第一金属表面和第二金属表面，通孔的内壁涂有金属。