인쇄회로 기판에 땜납 적용 방법 및 장치
    1.
    发明公开
    인쇄회로 기판에 땜납 적용 방법 및 장치 失效
    将焊料应用于印刷电路板的方法和设备

    公开(公告)号:KR1019950016466A

    公开(公告)日:1995-06-17

    申请号:KR1019940029107

    申请日:1994-11-04

    CPC classification number: B05B12/122 B05B12/06 B05B15/68 B23K1/203 H05K3/3489

    Abstract: 본발명은회로기판의관통홀내로의양호한침투와균일한두께를얻기위해무공기스프레이건을맥동시켜서회로기판에플럭스코팅을적용하는시스템및 방법을위한장치및 방법에관한것으로, 오버스프레이를감소시키고재료이용성과전달효율을증가시키는오버스프레이수집시스템을구비하며, 자동적으로조절되는건의위치결정기구는회로기판에대해건을정확하게위치시킨다.

    Abstract translation: 本发明涉及一种优良的渗透和由为了得到一种系统和方法以均匀的厚度施加熔剂涂层到电路板的装置和方法为通孔的基板的电路,降低了过喷脉动的无气喷枪 并且包括过喷收集系统,以增加材料的利用率和转印效率,定位机构建议自动地调整置于完全情况下,用于电路板。

    인쇄회로 기판에 땜납 적용 방법 및 장치
    3.
    发明授权
    인쇄회로 기판에 땜납 적용 방법 및 장치 失效
    将焊接电源应用于印刷电路的方法和装置

    公开(公告)号:KR100259672B1

    公开(公告)日:2000-06-15

    申请号:KR1019940029107

    申请日:1994-11-04

    CPC classification number: B05B12/122 B05B12/06 B05B15/68 B23K1/203 H05K3/3489

    Abstract: A conveyor transports the circuit board through a coating chamber in a direction of travel. An airless spray gun has a nozzle within the coating chamber, the gun being connected to a source of flux coating liquid and emitting a liquid spray pattern from the nozzle. A control is operatively connected to the spray gun for intermittently pulsing the gun on and off to coat a section of the circuit board in response to the circuit board moving a predetermined distance through the coating chamber. Adjacent coated sections partially overlap each other so that each of the sections is sprayed two or more times. The circuit board has through-holes between the upper surface and the under surface adapted to receive the leads of electrical components. The flux coating applied to the under surface of the circuit board penetrates into the through-holes.

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