公开(公告)号：KR1020090054814A

公开(公告)日：2009-06-01

申请号：KR1020070121694

申请日：2007-11-27

Applicant: 동신대학교산학협력단

Inventor： 고영혁 ,  김범석 ,  김찬백 ,  박성일 ,  박경천

IPC: H01Q23/00 ,  H01Q13/08

CPC classification number: H01Q5/30 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0407

Abstract: A multi band chip antenna for a mobile communication terminal is provided to maximize a gain by designing an internal chip antenna on the PCB(Printed Circuit Board). A multi-band chip antenna(A1) includes a ground plate(10), a top radiation patch(20), and a bottom radiation patch(30). A top and the bottom radiation patch are formed on the ground plate as meander shape at the top and bottom of the ground plate. A left and right end of each radiation patch are a short circuit with the ground plate. The multi band chip antenna for a mobile communications terminal is arranged on the PCB. The top of PCB is connected with the ground plate while being connected with a bottom radiation patch.

Abstract translation: 提供了用于移动通信终端的多频带芯片天线，以通过在PCB（印刷电路板）上设计内部芯片天线来最大化增益。 多频带芯片天线（A1）包括接地板（10），顶部辐射贴片（20）和底部辐射贴片（30）。 顶部和底部辐射贴片在接地板上形成为在接地板顶部和底部的曲折形状。 每个辐射贴片的左右端与接地板短路。 用于移动通信终端的多频带芯片天线布置在PCB上。 PCB的顶部与底板连接，同时与底部辐射贴片连接。