公开(公告)号：KR1020100008880A

公开(公告)日：2010-01-27

申请号：KR1020080069487

申请日：2008-07-17

Applicant: 레이트론(주)

Inventor： 노호섭

IPC: H01L21/603

CPC classification number: H01L2224/48 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48456 ,  H01L2224/48465 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A reinforcement method for a wire bonding part of a lead frame which is connected to a semiconductor chip through a wire is provided to reduce the failure rate of a semiconductor package by dotting a conductive adhesive on the wire bonding part. CONSTITUTION: The leading end of a capillary(20) embedded with a conductive wire is processed into a ball shape by high voltage spark. The ball-shaped end is moved to above a bonding pad of a semiconductor chip(30) and welded to a wire(10) by ultrasonic wave and heat. The capillary is moved to above a lead frame(40) and bonded by ultrasonic wave and heat so that the tip of the capillary is welded on one side of the lead frame. A conductive adhesive mixed with conductive metal powder is dotted on a wire bonding part(40a) of the lead frame, where thermal curable epoxy resin is employed as binder.

Abstract translation: 目的：提供一种通过导线与半导体芯片连接的引线框的引线接合部的加强方法，通过在导线接合部上点焊导电性粘合剂来降低半导体封装的故障率。 构成：嵌入导线的毛细管（20）的前端通过高压火花加工成球形。 将球形端移动到半导体芯片（30）的接合焊盘的上方，并通过超声波和热焊接到线（10）。 毛细管移动到引线框架（40）的上方，并通过超声波和热量结合，使得毛细管尖端焊接在引线框架的一侧。 与导电金属粉末混合的导电粘合剂点缀在引线框架的引线接合部分（40a）上，其中使用热固化性环氧树脂作为粘合剂。