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公开(公告)号：KR1020140109756A
公开(公告)日：2014-09-16
申请号：KR1020130024160
申请日：2013-03-06
Applicant: 삼성전기주식회사
Inventor： 고선효
IPC: G02B7/02
CPC classification number: G02B7/09 , G02B7/021 , G03B17/12 , H04N5/2252 , H04N5/2253 , H04N5/2254
Abstract: The present invention relates to a lens module and a manufacturing method thereof and, more specifically, to a lens module comprising: a substrate to which an image sensor is mounted; a fixing solder ball formed on the substrate; and a housing combined with the substrate and having a coupling hole which accommodates the fixing solder ball, and improving the airtightness between the substrate and a lens barrel or the housing and the alignment between the substrate and the housing being combined, and to a manufacturing method thereof.
Abstract translation: 镜头模块及其制造方法技术领域本发明涉及透镜模块及其制造方法，更具体地，涉及一种透镜模块，包括：安装有图像传感器的基板; 形成在基板上的固定焊球; 以及与基板结合的壳体，并且具有容纳固定焊球的联接孔，并且改善了基板和透镜镜筒或壳体之间的气密性以及基底和壳体之间的对准被组合，并且涉及制造方法 它们。
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公开(公告)号：KR1020130099470A
公开(公告)日：2013-09-06
申请号：KR1020120021013
申请日：2012-02-29
Applicant: 삼성전기주식회사
Inventor： 고선효
IPC: H04N5/225
CPC classification number: B23K1/0016 , B23K35/025 , H04N5/2253
Abstract: PURPOSE: A soldering method for camera module is provided to solder a module substrate onto an actuator substrate at the same time soldering the module substrate onto a main substrate, thereby simplifying the soldering process of the camera module and reducing the process time. CONSTITUTION: A camera module comprises a housing, a module substrate (120), and an actuator substrate (110). Solder (130) is dispensed between a connection terminal (111) of the actuator substrate and a connection pad of the module substrate. The connection pad and the connection terminal are soldered while the module substrate is soldered onto a main substrate of an external electronic component through a hot bar process. The solder is the low-temperature solder of a cream type.
Abstract translation: 目的：提供相机模块的焊接方法，将模块基板焊接到致动器基板上，同时将模块基板焊接到主基板上，从而简化相机模块的焊接过程并缩短处理时间。 构成：相机模块包括壳体，模块基板（120）和致动器基板（110）。 焊料（130）被分配在致动器基板的连接端子（111）和模块基板的连接焊盘之间。 当通过热棒工艺将模块衬底焊接到外部电子部件的主衬底上时，连接焊盘和连接端子被焊接。 焊料是奶油型的低温焊料。
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公开(公告)号：KR101128642B1
公开(公告)日：2012-03-26
申请号：KR1020100064813
申请日：2010-07-06
Applicant: 삼성전기주식회사
Abstract: 본 발명은 카메라 모듈의 제조를 위한 핫바 공정(hot-bar process)을 수행하는 장치에 관한 것으로, 본 발명의 실시예에 따른 핫바 공정 장치는 예비 카메라 모듈을 지지하는 제1 지지체, 예비 카메라 모듈에 접합시키고자 하는 인쇄회로기판을 지지하는 제2 지지체, 제1 지지체에 의해 지지된 예비 카메라 모듈과 제2 지지체에 의해 지지된 인쇄회로기판을 서로 가압시키는 가압기를 포함하되, 가압기는 제1 지지체에 구비되어 카메라 모듈을 예비 가압시키는 제1 가압기 및 제1 지지체의 상부으로부터 이격되어 배치되며, 카메라 모듈을 본압으로 가압시키는 제2 가압기를 포함한다.
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Patent Agency Ranking
公开(公告)号：KR1020120118697A
公开(公告)日：2012-10-29
申请号：KR1020110036228
申请日：2011-04-19
Applicant: 삼성전기주식회사
IPC: H04N5/225
CPC classification number: H04N5/2252 , H04N5/2253 , H04N5/2254
Abstract: PURPOSE: A camera module and a manufacturing method thereof are provided to easily form electronic connection between a lens unit and a substrate unit through a process combining the lens unit with the substrate unit. CONSTITUTION: A lens unit(400) includes a connection terminal which is downwardly protruded for forming electronic connection. A conductive clip unit(200) accepts the connection terminal. A substrate unit(100) forms electronic connection in the conductive clip unit. The substrate unit is connected to a lower side of the lens unit. The conductive clip unit has a form of U-shape which is upward opened. Both sides of the conductive clip pressure to both ends of the connection terminal. The substrate unit includes an insertion hole which the conductive clip unit is inserted.
Abstract translation: 目的：提供相机模块及其制造方法，以通过将透镜单元与基板单元组合的工艺容易地形成透镜单元和基板单元之间的电子连接。 构成：透镜单元（400）包括向下突出以形成电子连接的连接端子。 导电夹单元（200）接受连接端子。 基板单元（100）在导电夹单元中形成电连接。 基板单元连接到透镜单元的下侧。 导电夹单元具有向上打开的U形形式。 导电夹两侧压力连接端子两端。 基板单元包括插入导电夹单元的插入孔。
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公开(公告)号：KR1020120004126A
公开(公告)日：2012-01-12
申请号：KR1020100064813
申请日：2010-07-06
Applicant: 삼성전기주식회사
CPC classification number: H05K13/0023 , H04N5/2257 , H05K3/361
Abstract: PURPOSE: A hot-bar process apparatus for manufacturing a camera module and a method thereof are provided to reduce cooling time after bonding a spare camera module to a printed circuit board. CONSTITUTION: A pressurizer(120) presses a spare camera module(11) and a PCB(Printed Circuit Board)(18). A first pressurizer(122) is arranged on a first support member(112). The first support member pressurizes the camera module. A second pressurizer(124) is separated from the upper part of the first supporter. The second pressurizer pressurizes the camera module by a main pressure.
Abstract translation: 目的：提供一种用于制造相机模块的热条处理装置及其方法，以在将备用相机模块连接到印刷电路板之后减少冷却时间。 构成：加压器（120）按下备用照相机模块（11）和PCB（印刷电路板）（18）。 第一加压器（122）布置在第一支撑构件（112）上。 第一支撑构件对相机模块加压。 第二加压器（124）与第一支撑件的上部分离。 第二个加压器通过主压力对相机模块进行加压。
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公开(公告)号：KR1020130040425A
公开(公告)日：2013-04-24
申请号：KR1020110105181
申请日：2011-10-14
Applicant: 삼성전기주식회사
Inventor： 고선효
CPC classification number: G03B3/02 , G02B7/04 , H04N5/2251 , H04N5/2257 , H04N5/23212
Abstract: PURPOSE: A camera module package of a surface mounting type is provided to improve bonding strength between parts even though the camera module package is formed by bonding a rigid substrate and a rigid substrate, thereby preventing progressive failure. CONSTITUTION: A camera module package of a surface mounting type comprises a housing unit(120), a rigid substrate(140a), and a flexible substrate. The housing unit is assembled to be movable with a lens barrel to an optical shaft. An image sensor throwing the lights transmitted through a lens is mounted on the top of the rigid substrate with a soldering mode. The flexible substrate includes a connection pad electrically connected to an external connection terminal of the rigid substrate, thereby vertically bonding with the rigid substrate. A molten point of a solder or an ACF(Anisotropic Conductive Film) utilized for bonding the image sensor and the rigid substrate is higher than that utilized for bonding the image sensor and the flexible substrate.
Abstract translation: 目的：提供一种表面安装型相机模块封装，以提高部件之间的接合强度，即使通过粘合刚性基板和刚性基板形成相机模块封装，从而防止渐进式故障。 构成：表面安装型的相机模块封装包括壳体单元（120），刚性基板（140a）和柔性基板。 壳体单元组装成可与镜筒一起移动到光轴。 投射透过透镜的光的图像传感器以焊接模式安装在刚性基板的顶部。 柔性基板包括电连接到刚性基板的外部连接端子的连接焊盘，从而与刚性基板垂直接合。 用于粘合图像传感器和刚性基板的焊料或ACF（各向异性导电膜）的熔点高于用于粘合图像传感器和柔性基板的熔点。
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公开(公告)号：KR1020090078475A
公开(公告)日：2009-07-20
申请号：KR1020080004318
申请日：2008-01-15
Applicant: 삼성전기주식회사
CPC classification number: H04N5/2253 , G02B7/04 , G03B17/02 , H04N5/2252
Abstract: A camera module capable of accurately and conveniently performing focusing process and preventing focusing process is provided to simplify an assembly process and improve assembly power by improving a screw-type assembling structure of a lens barrel and a housing. An image sensor(120) is mounted on a substrate(110). A housing is installed on an upper part of the substrate. A pressurizing groove is formed in the upper inner cylindrical surface of the housing. A lens barrel is installed at 'the top of the housing. A pressurizing projection is formed in the forcing groove. The forcing groove of the housing is formed with the recess shape.
Abstract translation: 提供能够精确且方便地执行聚焦过程并防止聚焦过程的照相机模块，以通过改进透镜镜筒和外壳的螺杆型组装结构来简化组装过程并提高组装能力。 图像传感器（120）安装在基板（110）上。 壳体安装在基板的上部。 在壳体的上内圆柱面上形成有加压槽。 镜头筒安装在“顶部的外壳”。 在强制槽中形成有加压突起。 壳体的推压槽形成为凹部形状。
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