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公开(公告)号：KR1020140048562A
公开(公告)日：2014-04-24
申请号：KR1020120114661
申请日：2012-10-16
Applicant: 삼성전기주식회사
CPC classification number: H04N17/002 , H04N5/232
Abstract: The present invention relates to a system and a method for correcting an offset of a camera for a mobile processor. The system for correcting an offset of a camera for a mobile processor according to one embodiment of the present invention comprises a camera module for receiving offset information to be stored and outputting the acquired image data and the offset information; a mobile processor module which has an ISP for receiving the image data and the offset information from the camera module to process an image signal, is to output the processed image signal, and is to change a control right according to a control right change request from a buffer board module; the buffer board module for acquiring the offset information from the image signal transmitted by the mobile processor module, transmitting the control right change request to the mobile processor module and providing the camera module with the offset information according to the control right change of the mobile processor module; and a switching module which includes a first switch module arranged in a communication line between the mobile processor module and the camera module and a second switch module arranged in a communication line between the buffer board module and the camera module, wherein the first switch module is switched off and the second switch module is switched on according to the control right change of the mobile processor module. Furthermore, the method for correcting an offset of a camera for a mobile processor is disclosed. [Reference numerals] (10) Camera module; (31) Application processor; (33) Non-memory IC; (50) Buffer board module
Abstract translation: 本发明涉及用于校正移动处理器的相机偏移的系统和方法。 根据本发明的一个实施例的用于校正移动处理器的相机的偏移的系统包括用于接收要存储的偏移信息并输出所获取的图像数据和偏移信息的相机模块; 具有用于接收图像数据的ISP和来自相机模块的处理图像信号的偏移信息的移动处理器模块是输出处理后的图像信号，并且根据控制权变更请求改变控制权 缓冲板模块; 缓冲板模块，用于从移动处理器模块发送的图像信号中获取偏移信息，将控制权改变请求发送到移动处理器模块，并根据移动处理器的控制权变化向相机模块提供偏移信息 模块; 以及切换模块，其包括布置在所述移动处理器模块和所述相机模块之间的通信线路中的第一开关模块和布置在所述缓冲板模块和所述相机模块之间的通信线路中的第二开关模块，其中所述第一开关模块是 根据移动处理器模块的控制权变化，关闭第二交换机模块并接通。 此外，公开了用于校正移动处理器的相机的偏移的方法。 （附图标记）（10）相机模块; （31）应用处理器; （33）非存储IC; （50）缓冲板模块
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公开(公告)号：KR101365328B1
公开(公告)日：2014-02-20
申请号：KR1020120051554
申请日：2012-05-15
Applicant: 삼성전기주식회사
Abstract: 본 발명은 카메라 모듈 및 카메라 모듈의 제조 방법에 관한 것으로, 렌즈배럴이 광축방향으로 이동가능하도록 결합된 렌즈 하우징과, 상기 렌즈 하우징의 하부에 결합되며, 상기 렌즈배럴을 통해 유입된 광을 전기적인 신호로 바꾸는 이미지센서와 이미지센서가 실장되는 다층의 인쇄회로기판으로 구성된 이미지센서 모듈 및 상기 이미지센서 모듈과 렌즈 하우징에 각각 형성되는 자력 부재를 포함할 수 있다.
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公开(公告)号：KR1020130029660A
公开(公告)日：2013-03-25
申请号：KR1020110093064
申请日：2011-09-15
Applicant: 삼성전기주식회사
Inventor： 신동민
CPC classification number: G03B3/02 , G02B5/208 , G02B7/006 , G02B7/04 , H04N5/2254 , H04N5/2257
Abstract: PURPOSE: A camera module is provided to enhance the inclination of a package process by preventing the inclination of an image sensor when the image sensor is placed on a circuit board. CONSTITUTION: A camera module comprises a lens, a barrel, an infrared filter, a holder, a circuit board(110), a pattern, and image sensors(120). The lens is mounted on the barrel. The infrared filter blocks infrared rays from light entered from the lens. The holder fixes the barrel and the infrared filter. The circuit board is mounted under the holder and applies all kinds of electric signals. The pattern is mounted on the top of the circuit board to form an opened section. The image sensors are mounted on the top of the pattern to convert optical signals to image signals. The opened section has a bond part(130) for boning the circuit board and the image sensor.
Abstract translation: 目的：提供一种相机模块，用于通过在将图像传感器放置在电路板上时防止图像传感器倾斜来增强包装过程的倾斜度。 构成：相机模块包括透镜，镜筒，红外滤光器，保持器，电路板（110），图案和图像传感器（120）。 镜头安装在镜筒上。 红外滤光片阻挡从镜头进入的光线的红外线。 保持架固定枪管和红外线过滤器。 电路板安装在支架下，并应用各种电信号。 该图案安装在电路板的顶部以形成打开的部分。 图像传感器安装在图案的顶部，以将光信号转换成图像信号。 打开部分具有用于将电路板和图像传感器进行烙印的接合部分（130）。
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公开(公告)号：KR1020110048082A
公开(公告)日：2011-05-11
申请号：KR1020090103448
申请日：2009-10-29
Applicant: 삼성전기주식회사
IPC: H01R12/70
Abstract: PURPOSE: A connecting substrate and a camera module includes the same are provided to improve a reliability of electronic connection. CONSTITUTION: A connecting substrate(100) includes an insulating layer(110), a circuit pattern(112), a plurality of connecting terminal(120), and a plating lead line(130). The circuit pattern is formed on the insulating layer. The plurality of connecting terminal is formed on a end part of the circuit pattern in parallel. The plating lead line is expanded to an external side of the connecting terminal which is arranged on both sides of the connecting terminals.
Abstract translation: 目的：提供连接基板和相机模块，以提高电子连接的可靠性。 构成：连接基板（100）包括绝缘层（110），电路图案（112），多个连接端子（120）和电镀引线（130）。 电路图案形成在绝缘层上。 多个连接端子平行地形成在电路图案的端部上。 电镀引线扩展到布置在连接端子两侧的连接端子的外侧。
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公开(公告)号：KR1020110022890A
公开(公告)日：2011-03-08
申请号：KR1020090080385
申请日：2009-08-28
Applicant: 삼성전기주식회사
CPC classification number: H04N5/2256 , G03B15/0405 , H03M1/66 , H04N21/4821
Abstract: PURPOSE: A strobe driving device of a camera is provided to supply a different reference voltage value per distance by using a DAC(Digital to Analog Converter). CONSTITUTION: A DAC(16) changes a first reference signal according to a control signal transmitted from a control unit into a second reference which is capable of emitting light emitting quantity suitable for a photographing distance. A strobe driving unit(110) transmits photographing distance and illuminance information to the control unit. The strobe driving unit drives a flash to generate light emitting amount suitable for photographing distance by using a second reference voltage which is transmitted from the DAC.
Abstract translation: 目的：提供相机的闪光灯驱动装置，通过使用DAC（数模转换器）为距离提供不同的参考电压值。 构成：DAC（16）根据从控制单元发送的控制信号将第一参考信号改变为能够发射适合于拍摄距离的发光量的第二参考。 频闪驱动单元（110）将拍摄距离和照度信息发送到控制单元。 选通驱动单元通过使用从DAC发送的第二参考电压来驱动闪光以产生适合于拍摄距离的发光量。
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Patent Agency Ranking
公开(公告)号：KR1020110020663A
公开(公告)日：2011-03-03
申请号：KR1020090078390
申请日：2009-08-24
Applicant: 삼성전기주식회사
Inventor： 신동민
Abstract: PURPOSE: A mounting assembly module is provided to mount a plurality of mounting devices on a printed circuit board by guiding the mounting position on the right position of the pad. CONSTITUTION: A device mounting module comprises a printed circuit board(100), a pad(120) of the rectangular type, a solder layer(140), and an LED module(160). The LED module forms the solder layer by being supplied with the soldering lead on the pad. The solder lead is electrically bonded by the soldering.
Abstract translation: 目的：提供安装组件模块，通过将安装位置引导到焊盘的正确位置，将多个安装装置安装在印刷电路板上。 构成：装置安装模块包括印刷电路板（100），矩形焊盘（120），焊料层（140）和LED模块（160）。 LED模块通过在焊盘上提供焊接引线来形成焊料层。 焊锡引线通过焊接电接合。
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公开(公告)号：KR1020100043829A
公开(公告)日：2010-04-29
申请号：KR1020080103042
申请日：2008-10-21
Applicant: 삼성전기주식회사
Inventor： 신동민
IPC: H04N5/225
CPC classification number: H04N5/2254 , G02B7/026 , H04N5/2252 , H04N5/3572
Abstract: PURPOSE: A camera module is provided to perform a granular process in a side of a protrusion part formed inside a housing, thereby realizing a clear image. CONSTITUTION: A protrusion part is formed on the inner circumference of a hollow housing(120). A lens barrel(110) is inserted into the upper side of the housing. A printed circuit board(140) is combined with the lower side of the housing. An image sensor(150) is mounted on the printed circuit board. An optical filter(130) is mounted in the lower side of the protrusion part. A granular process is performed in a side of the protrusion part.
Abstract translation: 目的：提供一种相机模块，用于在形成在壳体内部的突出部分的一侧执行颗粒处理，从而实现清晰的图像。 构成：在中空壳体（120）的内周上形成突起部。 透镜镜筒（110）插入壳体的上侧。 印刷电路板（140）与壳体的下侧组合。 图像传感器（150）安装在印刷电路板上。 滤光器（130）安装在突出部分的下侧。 在突出部的一侧进行粒状处理。
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公开(公告)号：KR100770682B1
公开(公告)日：2007-10-29
申请号：KR1020060102550
申请日：2006-10-20
Applicant: 삼성전기주식회사
IPC: H04B1/38
CPC classification number: H04M1/0277 , H04M1/0264
Abstract: A camera device and a portable terminal having the same are provided to prevent a crack from occurring in a circuit pattern of a flexible PCB(Printed Circuit Board) which electrically connects a camera module to a main board when the camera module rotates. A camera device comprises a rotary lens tube, a camera module(320), and a flexible PCB(330). The camera module(320), embedded in the rotary lens tube, rotates in one body with the rotary lens tube according as the rotary lens tube rotates. The flexible PCB(330) is electrically connected to a main board embedded in a main body. The camera module(320) includes a lens barrel(321), a housing(322) and an image sensor. The lens barrel(321) has a group of lenses. The housing(322) is installed under the lens barrel(321). The image sensor converts optical signals, inputted via the group of lenses, into image signals. The flexible PCB(330), composed of an upper flexible PCB(331) and a lower flexible PCB(332) separated according to a circuit pattern, forwards the converted image signal to the main board. In case that the flexible PCB(330) gets rolled when the camera module(320) rotates, the upper flexible PCB(331), positioned at an outside, gets longer than the lower flexible PCB(332), positioned at an inside.
Abstract translation: 提供了一种相机装置和具有该相机装置的便携式终端，以防止当相机模块旋转时将相机模块电连接到主板的柔性PCB（印刷电路板）的电路图案中发生裂纹。 相机装置包括旋转透镜管，相机模块（320）和柔性PCB（330）。 嵌入在旋转透镜管内的相机模块（320）根据旋转透镜管旋转而与旋转透镜管一体旋转。 柔性PCB（330）电连接到嵌入在主体中的主板。 相机模块（320）包括镜筒（321），壳体（322）和图像传感器。 镜筒（321）具有一组透镜。 壳体（322）安装在镜筒（321）的下方。 图像传感器将经由一组透镜输入的光信号转换为图像信号。 由根据电路图案分离的上柔性PCB（331）和下柔性PCB（332）组成的柔性PCB（330）将转换的图像信号转发到主板。 在相机模块（320）旋转时柔性PCB（330）卷起的情况下，定位在外部的上部柔性PCB（331）比位于内部的下部柔性PCB（332）更长。
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公开(公告)号：KR1020070035226A
公开(公告)日：2007-03-30
申请号：KR1020050089837
申请日：2005-09-27
Applicant: 삼성전기주식회사
IPC: H04N5/225
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14685 , H01L2924/0002 , H04N5/2257 , H05K1/0274 , H05K1/189 , H05K2201/09072 , H05K2201/10121 , H01L2924/00
Abstract: 본 발명은 이미지 센서 모듈과 이를 이용한 카메라 모듈 및 카메라 모듈의 제조방법에 관한 것으로, 기존의 플립칩 방식의 COF(Chip On Flim) 패키징 방식 또는 와이어 본딩 방식의 COB(Chip On Board) 패키징 방식에 의하여 발생되는 공차를 최소화하여 광축 틀어짐(틸팅 및 로테이션) 현상을 방지할 수 있는 이점이 있다.
이를 위한 본 발명에 의한 카메라 모듈 제조방법은, 윈도우창을 구비한 FPCB의 폭과 실질적으로 동일한 크기의 이미지센서를 상기 FPCB의 배면 상에 부착하여 이미지센서 모듈을 제공하는 단계, 및 상기 이미지센서가 부착된 FPCB의 배면의 반대면 방향으로부터, 렌즈부를 지지하는 하우징의 하부 개방부 내주면에 상기 이미지센서 모듈을 결합하여 부착하되, 상기 결합은 상기 이미지센서의 외주면을 가이드로 하여 수행하는 단계를 포함한다.
카메라 모듈, 이미지센서 모듈, 패키징, COF, 플립칩, 가이드Abstract translation: 本发明中，通过的是，（板上芯片）的常规倒装芯片方法COF的COB芯片（Chip On弗利姆）根据相机模块的制造方法和相机模块使用相同和图像传感器模块的包装方法或引线键合方案的包装方法 具有可以通过最小化所产生的公差来防止出现光轴倾斜（倾斜和旋转）的优点。
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公开(公告)号：KR1020140135008A
公开(公告)日：2014-11-25
申请号：KR1020130055195
申请日：2013-05-15
Applicant: 삼성전기주식회사
CPC classification number: H04N17/002 , H04N5/2257
Abstract: 본 발명은 카메라모듈 테스트장치에 관한 것이다. 본 발명에 따른 카메라모듈 테스트장치는 카메라모듈이 장착되는 서브 보드와 AP 칩 및 방열부가 구비된 메인 보드의 구조개선으로 인해 상기 방열부를 동반한 테스트장치의 전체적인 높이 및 부피의 감소가 가능하다. 또한 상기 AP 칩 및 방열부는 보호케이스를 통해 보호함으로써, 외부충격으로부터 보호가 가능하여 테스트장치의 전반적인 수명을 용이하게 연장할 수 있으며, 이로 인해 비용절감 등의 효과가 있다.
Abstract translation: 本发明涉及一种相机模块测试装置。 根据本发明的相机模块测试装置可以通过重构包括其中安装相机模块的子板的主板，AP芯片来降低具有散热部分的测试装置的整体高度和体积， 和散热部。 通过由保护壳保护AP芯片和散热部分免受外部冲击，可以容易地延长测试装置的整体使用寿命，从而具有降低成本的效果。
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