公开(公告)号：KR1020030008664A

公开(公告)日：2003-01-29

申请号：KR1020010043504

申请日：2001-07-19

Applicant: 삼성전자주식회사

Inventor： 고정상 ,  김태균 ,  조경일

IPC: F25D1/02

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10S257/93 ,  H01L2924/00

Abstract: PURPOSE: A micro-cooling device is provided to achieve superior cooling efficiency and simplified configuration, while reducing costs for micro-channel array. CONSTITUTION: A micro-cooling device comprises a substrate(210) having a bottom surface with a predetermined area contacting a heat source(H); a micro-channel array(212) arranged on the substrate, and which has a refrigerant concentration portion corresponding to the predetermined area of the bottom surface of the substrate; and a cooling cap(214) for fixing the micro-channel array, condensing the vapor generated during the process of cooling the heat source, and permitting the condensed matter to be introduced into the micro-channel array. The micro-channel array includes one or more units(212a) where the refrigerant is introduced into the refrigerant concentration portion by a capillary force.

Abstract translation: 目的：提供微型冷却装置，以实现卓越的冷却效率和简化配置，同时降低微通道阵列的成本。 构造：微冷却装置包括具有与热源（H）接触的预定面积的底表面的基底（210）; 布置在所述基板上的微通道阵列（212），并且具有对应于所述基板的所述底面的规定区域的制冷剂浓度部; 以及用于固定所述微通道阵列的冷却帽（214），冷凝在所述热源的冷却过程中产生的蒸气，并且使所述冷凝物质被引入所述微通道阵列。 微通道阵列包括一个或多个单元（212a），其中制冷剂通过毛细管力被引入制冷剂浓缩部分。

公开(公告)号：KR100429840B1

公开(公告)日：2004-05-04

申请号：KR1020010043504

申请日：2001-07-19

Applicant: 삼성전자주식회사

Inventor： 고정상 ,  김태균 ,  조경일

IPC: F25D1/02

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10S257/93 ,  H01L2924/00

Abstract: A microcooling device is provided. The microcooling device includes a substrate, a microchannel array, and a condenser. A predetermined region of a lower surface of the substrate contacts a heat source. The microchannel array is placed on the substrate so that a coolant concentrating portion is opposite to the predetermined region of the lower surface. The condenser fixes the microchannel array, condenses vapor generated in a process of cooling the heat source, and allows the condensed vapor to flow into the microchannel array.

Abstract translation: 提供微冷却装置。 微冷却装置包括基板，微通道阵列和冷凝器。 衬底的下表面的预定区域接触热源。 将微通道阵列放置在基板上，使得冷却剂浓缩部分与下表面的预定区域相对。 冷凝器固定微通道阵列，冷凝在热源冷却过程中产生的蒸气，并使冷凝的蒸气流入微通道阵列。

公开(公告)号：KR100343221B1

公开(公告)日：2002-07-10

申请号：KR1019990049418

申请日：1999-11-09

Applicant: 삼성전자주식회사

Inventor： 임근배 ,  윤하용 ,  이정현 ,  박유근 ,  고정상 ,  김성진

IPC: H01L23/34

CPC classification number: H01L23/467 ,  F28F13/02 ,  F28F13/18 ,  F28F13/185 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: 본발명은미세구조의냉각핀을가지는냉각장치에관해개시된다. 냉각장치는: 기판과; 상기기판으로부터연장되어있는다수의진동형냉각핀과; 상기기판에공기를송풍하여상기기판및 냉각핀을냉각시킴과아울러상기진동형냉각핀에진동력을제공하는송풍팬을; 구비한다. 본발명에따르면, 기판의표면에형성된미세구조의냉각핀은공기유통경로의기하학적형상을바꿈과아울러진동에의해기판의표면가까이에서열전달능력이향상되게한다. 즉, 매끈한표면에형성되는열 경계층의형성을방해함으로써열전달저항을줄여열전달성능을향상시키게된다. 이러한본 발명의냉각장치는기존장치에비해열전달성능이향상됨으로써, 열전달면적과부피의감소가가능하고따라서소형화가가능하다.

公开(公告)号：KR100425345B1

公开(公告)日：2004-03-30

申请号：KR1020010046037

申请日：2001-07-30

Applicant: 삼성전자주식회사

Inventor： 고정상 ,  이용수

IPC: F28D17/02

Abstract: PURPOSE: A micro cooling apparatus with porous medium is provided to improve cooling efficiency for chips with relatively higher calorification. CONSTITUTION: A micro cooling apparatus(100) includes a base plate(102) having a heat source contacting with a part of a bottom thereof; porous medium(40) placed on a part of an outside of the base plate corresponding with the heat source to supply refrigerant for cooling the heat source and having distribution of pores to generate capillary action from the outside to the part; and a condensing device condensing steam generated during cooling the heat source to supply to the porous medium.

Abstract translation: 目的：提供一种具有多孔介质的微型冷却装置，以提高具有较高热量的芯片的冷却效率。 构成：微型冷却装置（100）包括：基板（102），其具有与其底部的一部分接触的热源; 多孔介质（40），其放置在与热源相对应的基板的外侧的一部分上，以供应用于冷却热源的制冷剂，并具有孔的分布以从外部到部件产生毛细管作用; 以及冷凝装置，冷凝在热源冷却期间产生的蒸汽以供应给多孔介质。

公开(公告)号：KR1020030012148A

公开(公告)日：2003-02-12

申请号：KR1020010046037

申请日：2001-07-30

Applicant: 삼성전자주식회사

Inventor： 고정상 ,  이용수

IPC: F28D17/02

Abstract: PURPOSE: A micro cooling apparatus with porous medium is provided to improve cooling efficiency for chips with relatively higher calorification. CONSTITUTION: A micro cooling apparatus(100) includes a base plate(102) having a heat source contacting with a part of a bottom thereof; porous medium(40) placed on a part of an outside of the base plate corresponding with the heat source to supply refrigerant for cooling the heat source and having distribution of pores to generate capillary action from the outside to the part; and a condensing device condensing steam generated during cooling the heat source to supply to the porous medium.

Abstract translation: 目的：提供具有多孔介质的微型冷却装置，以提高具有相对较高热量的芯片的冷却效率。 构造：微型冷却装置（100）包括：底板（102），其具有与其底部的一部分接触的热源; 多孔介质（40）放置在与热源对应的基板的外部的一部分上，以供应用于冷却热源的制冷剂并具有从外部向该部分产生毛细作用的孔的分布; 以及冷凝装置，冷凝在冷却热源期间产生的蒸汽以供应到多孔介质。

公开(公告)号：KR1020010045906A

公开(公告)日：2001-06-05

申请号：KR1019990049418

申请日：1999-11-09

Applicant: 삼성전자주식회사

Inventor： 임근배 ,  윤하용 ,  이정현 ,  박유근 ,  고정상 ,  김성진

IPC: H01L23/34

CPC classification number: H01L23/467 ,  F28F13/02 ,  F28F13/18 ,  F28F13/185 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: PURPOSE: A cooling apparatus having a micro cooling fin is provided to improve heat transfer capacity by preventing a heat boundary layer formed on a smooth surface of the board to reduce heat transfer resistance. CONSTITUTION: A plurality of vibrating cooling fins(12) are extended from a board(10). An air blower blows air to the board to cool the board and the cooling fin, and supplies vibrating power to the vibrating cooling fin. The vibrating cooling fin is extended in a plane direction of the board, and has a cavity part under the vibrating cooling fin.

Abstract translation: 目的：提供具有微型散热片的冷却装置，通过防止形成在板的光滑表面上的热边界层降低传热阻力来提高传热能力。 构成：多个振动散热片（12）从板（10）延伸。 鼓风机将空气吹到板上以冷却板和冷却片，并向振动散热片提供振动功率。 振动冷却翅片在板的平面方向上延伸，并且在振动散热片下方具有空腔部。