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    测试半导体器件的方法

    公开(公告)号:KR1020040039939A

    公开(公告)日:2004-05-12

    申请号:KR1020020068192

    申请日:2002-11-05

    Inventor: 김세한

    Abstract: PURPOSE: A method for testing a semiconductor device is provided to easily find defective elements that are regular in each die by comparing a yield of each die constituting a wafer with an average yield of peripheral dies surrounding the die and by determining and displaying whether the local yield of each die varies. CONSTITUTION: The yield of each die(X,A,B,C,D) of the wafer is measured. The average yield of the dies in the periphery of a specific die among the dies is obtained. The average yield of the peripheral dies is compared with the yield of the specific die to test the die, wherein a die with a defective element and a die without a defective element are divided according to the comparison value.

    Abstract translation: 目的:提供一种用于测试半导体器件的方法,通过将构成晶片的每个管芯的产量与裸片周围的模具的平均产量进行比较,并且通过确定和显示本地 每个模具的产量变化。 构成:测量晶片的每个模具(X,A,B,C,D)的产量。 获得模具中的特定模具周边的模具的平均产量。 将周边模具的平均产量与特定模具的成品率进行比较以测试模具,其中根据比较值分割具有缺陷元件的模具和没有缺陷元件的模具。

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