公开(公告)号：KR1020030095161A

公开(公告)日：2003-12-18

申请号：KR1020020036005

申请日：2002-06-26

Applicant: 삼성전자주식회사

Inventor： 김병주 ,  황인석 ,  이호열 ,  변수민 ,  김형구 ,  지준수

IPC: H01L21/304

CPC classification number: B24B19/16 ,  B08B1/00 ,  G01R3/00

Abstract: PURPOSE: An apparatus and method for cleaning a contact portion of a probe card are provided to be capable of reducing the fabrication cost of the apparatus and easily replacing the apparatus. CONSTITUTION: An apparatus(48) is provided with a breaker(50) having a plurality of ridged portions, a driving control part for controlling a probe needle in order to contact the breaker at a predetermined pressure, and a removing part for removing the particles(54) generated from the probe needle due to the contact between the breaker and the probe needle. Preferably, a silicon wafer is used as the breaker. Preferably, the driving control part includes at least one selected from a group consisting of a displacement part, an optical sensor, a pressure sensor, and a displacement sensor. Preferably, gravity is used as the removing part.

Abstract translation: 目的：提供用于清洁探针卡的接触部分的装置和方法，以能够降低装置的制造成本并容易地更换装置。 构成：设备（48）设置有具有多个脊部的断路器（50），用于控制探针以便以预定压力接触断路器的驱动控制部分和用于去除颗粒的去除部分 （54）由于断路器和探针之间的接触而由探针产生。 优选地，使用硅晶片作为断路器。 优选地，驱动控制部分包括从由位移部分，光学传感器，压力传感器和位移传感器组成的组中选择的至少一个。 优选地，使用重力作为除去部分。

公开(公告)号：KR100855582B1

公开(公告)日：2008-09-03

申请号：KR1020070003838

申请日：2007-01-12

Applicant: 삼성전자주식회사

Inventor： 남태영 ,  김태호 ,  김호왕 ,  이상곤 ,  안병호 ,  김형구

IPC: H01L21/208

CPC classification number: C23C16/4485 ,  C23C16/52

Abstract: 본 발명은 가스를 공급하여 버퍼 용기 내부를 가압함으로써 버퍼 용기 내에 채워진 케미컬을 버퍼 용기 외부로 공급하는 액 공급 장치를 제공한다. 본 발명에 의하면, 버퍼 용기의 내부 압력을 측정할 수 있는 압력 센서가 제공되며, 버퍼 용기 내부에 케미컬을 충전할 때 버퍼 용기 내부 압력이 설정 압력 이상이면 버퍼 용기 내 가스를 배기하도록 벤트 라인이 설치된다.
버퍼 용기, 전구체, 케미컬, 벤트 라인, 기화기

公开(公告)号：KR1020080066411A

公开(公告)日：2008-07-16

申请号：KR1020070003838

申请日：2007-01-12

Applicant: 삼성전자주식회사

Inventor： 남태영 ,  김태호 ,  김호왕 ,  이상곤 ,  안병호 ,  김형구

IPC: H01L21/208

CPC classification number: C23C16/4485 ,  C23C16/52

Abstract: An apparatus for supplying liquid is provided to increase the operating rate of equipment by enabling a continuous supply of chemicals. A space filled with liquid is provided by a buffer receptacle(410). A liquid introducing pipe(420) supplies liquid from a liquid storage receptacle to the inside of the buffer receptacle. A liquid supply pipe(440) supplies the liquid in the buffer receptacle to the outside of the buffer receptacle. A gas introducing pipe(430) supplies pressurized gas from the gas storage receptacle to the inside of the buffer receptacle to provide the pressure at which the liquid in the buffer receptacle is exhausted through the liquid supply pipe. A vent line(450) exhausts the pressurized gas in the buffer receptacle to the outside of the buffer receptacle, coupled to the buffer receptacle. A pressure measuring member(460) can measure the pressure in the buffer receptacle. The pressure measuring member can be a pressure gauge installed in the vent line.

Abstract translation: 提供一种用于供应液体的装置，以通过连续供应化学品来提高设备的运行速度。 填充有液体的空间由缓冲容器（410）提供。 液体导入管（420）将液体从液体储存容器供应到缓冲容器的内部。 液体供应管（440）将缓冲容器中的液体供应到缓冲容器的外部。 气体导入管（430）将加压气体从气体存储容器供应到缓冲容器的内部，以提供缓冲容器中的液体通过液体供应管排出的压力。 排气管线（450）将缓冲容器中的加压气体排出到与缓冲容器相连的缓冲容器的外部。 压力测量构件（460）可以测量缓冲容器中的压力。 压力测量构件可以是安装在排气管线中的压力表。

公开(公告)号：KR1020070063824A

公开(公告)日：2007-06-20

申请号：KR1020050124071

申请日：2005-12-15

Applicant: 삼성전자주식회사

Inventor： 김형구 ,  김병주 ,  황인석 ,  이준영 ,  김중현

IPC: H01L21/66

CPC classification number: G01R31/2601 ,  G01R1/07307

Abstract: A semiconductor test apparatus including a probe card with a heat shielding member is provided to effectively prevent the heat generated from a wafer from being conducted to a printed circuit board. Various circuits are formed on a printed circuit board(200), and a needle(210) is connected to the printed circuit board. The needle comes in contact with an input/output pad of a wafer(W) with a semiconductor device formed thereon. The needle is fixed to the printed circuit board by a fixing part(220). A heat shielding member(250) is interposed between the printed circuit board and the fixing portion. A probe card(20) is electrically connected to the needle, and has a pogo pad(230) transmitting and receiving a signal from a tester(240).

Abstract translation: 提供了包括具有隔热构件的探针卡的半导体测试装置，以有效地防止从晶片产生的热量被传导到印刷电路板。 在印刷电路板（200）上形成各种电路，并且将针（210）连接到印刷电路板。 针与其上形成有半导体器件的晶片（W）的输入/输出焊盘接触。 针通过固定部（220）固定在印刷电路板上。 在印刷电路板和固定部之间设置有隔热构件（250）。 探针卡（20）电连接到针，并且具有从测试器（240）发送和接收信号的弹簧垫（230）。

公开(公告)号：KR1020040064146A

公开(公告)日：2004-07-16

申请号：KR1020030001445

申请日：2003-01-09

Applicant: 삼성전자주식회사

Inventor： 황인석 ,  지준수 ,  남도현 ,  김형구 ,  김병주

IPC: G01R31/26 ,  H01L21/66

Abstract: PURPOSE: A semiconductor device tester is provided to minimize a waiting period of a probe station by transmitting GRIP commands corresponding to each process to a tester and installing a comparative logic program in the tester. CONSTITUTION: A semiconductor device tester includes a tester and a first and a second probe station. The first and the second probe stations(32,33) are used for generating commands corresponding to each process to the tester(31). The tester includes a comparative logic program in order to test simultaneously the first and the second probe station after the first probe station is paused in a test process and the second probe station finishes a wafer alignment process. Accordingly, the standby time of the first and the second probe stations is minimized by performing the test process.

Abstract translation: 目的：提供一种半导体器件测试器，通过将与每个过程相对应的GRIP命令传送给测试仪并将比较逻辑程序安装在测试仪中来最小化探测站的等待周期。 构成：半导体器件测试器包括测试仪和第一和第二探测台。 第一和第二探测台（32,33）用于向测试器（31）生成与每个处理相对应的命令。 测试仪包括比较逻辑程序，以便在测试过程中暂停第一探测站之后同时测试第一和第二探测台，并且第二探测站完成晶片对准过程。 因此，通过执行测试处理来最小化第一和第二探测站的待机时间。

公开(公告)号：KR100435529B1

公开(公告)日：2004-06-11

申请号：KR1020020036005

申请日：2002-06-26

Applicant: 삼성전자주식회사

Inventor： 김병주 ,  황인석 ,  이호열 ,  변수민 ,  김형구 ,  지준수

IPC: H01L21/304

CPC classification number: B24B19/16 ,  B08B1/00 ,  G01R3/00

Abstract: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

Abstract translation: 用于清洁集成电路测试探针装置的测试探针卡的多个电触点中的碎屑和残余物的设备和方法优选地包括具有凹槽表面的硅晶片，测试探针卡移动到该硅晶片中以进入加压接触。 凹槽表面提供了一种光栅结构，当与加压电触点结合时会压碎任何介入或附着的残留颗粒，然后颗粒破碎成更小的颗粒并从探针卡上脱落。 探针卡的压力和相对移动可以通过各种测量传感器来控制。

公开(公告)号：KR1020040014063A

公开(公告)日：2004-02-14

申请号：KR1020020047232

申请日：2002-08-09

Applicant: 삼성전자주식회사

Inventor： 지준수 ,  황인석 ,  김병주 ,  김형구 ,  장인훈

IPC: H01L21/66

Abstract: PURPOSE: A probe card for EDS test is provided to remove the noise from a probe part by installing a ground plate on a plate of a space transformer. CONSTITUTION: A probe card for EDS test includes a bottom plate(10), a PCB assembly(20), a support frame(30), a space transformer(60), an interposer(40), and a ground plate. The bottom plate(10) is adhered at a bottom side of a tester. The PCB assembly(20) is installed at a bottom of the bottom plate to load a PCB. The support frame(30) is used for supporting a bottom of the PCB assembly. The space transformer(60) is installed at a bottom of the support frame. The space transformer includes a probe part corresponding to a chip of a semiconductor substrate. The interposer(40) is inserted between the space transformer and the PCB assembly. The ground plate is arranged at the space transformer.

Abstract translation: 目的：提供用于EDS测试的探针卡，通过在空间变压器的平板上安装接地板来消除探头部件的噪音。 构成：用于EDS测试的探针卡包括底板（10），PCB组件（20），支撑框架（30），空间变压器（60），插入件（40）和接地板。 底板（10）粘接在测试仪的底侧。 PCB组件（20）安装在底板的底部以装载PCB。 支撑框架（30）用于支撑PCB组件的底部。 空间变压器（60）安装在支撑框架的底部。 空间变换器包括对应于半导体衬底的芯片的探针部分。 插入器（40）插入在空间变压器和PCB组件之间。 接地板配置在空间变压器上。