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公开(公告)号：WO2013024907A1
公开(公告)日：2013-02-21
申请号：PCT/KR2011/005927
申请日：2011-08-12
IPC: C08J5/18 , C08J7/00 , C09K11/00 , G02F1/1335
CPC classification number: C09K11/025 , B05D5/06 , C08J7/06 , C09K11/08
Abstract: 본 발명은 형광체 수지 필름의 제조방법 및 이에 의해 제조된 형광체 수지 필름에 관한 것으로, 보다 상세하게는 폴리머 수지와 잠재성 경화제를 용매에 혼합하여 폴리머 슬러리를 마련하는 단계, 상기 폴리머 슬러리를 필름 형상을 갖도록 도포하는 단계, 상기 도포된 폴리머 슬러리를 건조시켜 반경화된 수지필름을 형성하는 단계 및 상기 반경화된 수지필름 상에 형광체 분말을 제공하는 단계를 포함하는 형광체 수지 필름 제조방법, 및 폴리머 수지와 잠재성 경화제를 포함하며 반경화된 수지필름 및 상기 반경화된 수지필름의 일면에 상기 형광체가 균일하게 개재된 형광체 수지 필름에 관한 것이다.
Abstract translation: 本发明涉及一种制造荧光树脂膜的方法及其制造的荧光树脂膜。 更具体地说，本发明涉及荧光树脂膜的制造方法，其特征在于，包括以下步骤：将聚合物树脂和潜伏性固化剂与溶剂混合，制备聚合物浆料; 将聚合物浆料铺展成膜状; 干燥所施加的聚合物浆料以形成半固化树脂膜; 并将荧光粉置于半固化树脂膜上。 本发明还涉及包含聚合物树脂和潜在性固化剂的半固化树脂膜以及半固化树脂膜的一个表面均匀地涂覆有荧光粉末的荧光树脂膜。
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公开(公告)号：KR101521260B1
公开(公告)日：2015-05-18
申请号：KR1020080117310
申请日：2008-11-25
Applicant: 삼성전자주식회사
IPC: H01L33/52
CPC classification number: H01L33/62 , H01L24/45 , H01L24/48 , H01L24/97 , H01L33/486 , H01L33/56 , H01L2224/45139 , H01L2224/48091 , H01L2224/4824 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: 본발명은발광다이오드패키지및 이의제조방법에관한것이다. 본발명의발광다이오드패키지는, 기판; 상기기판상부에실장되는 LED 칩;상기 LED 칩의외표면을포함한상기기판의상부에도포되는몰딩재; 및상기기판의하부에도포되는봉지재;를포함하며, 발광효율이향상되고, 패키지불량을감소시킬수 있으며, 제작공정이용이하여제작단가를절감할수 있는작용효과가발휘될수 있다.
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公开(公告)号：KR1020100058779A
公开(公告)日：2010-06-04
申请号：KR1020080117310
申请日：2008-11-25
Applicant: 삼성전자주식회사
IPC: H01L33/52
CPC classification number: H01L33/62 , H01L24/45 , H01L24/48 , H01L24/97 , H01L33/486 , H01L33/56 , H01L2224/45139 , H01L2224/48091 , H01L2224/4824 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to improve light emission efficiency by coating fluorescent material directly on the surface of the light emitting diode device. CONSTITUTION: An LED chip(120) is mounted on the upper part of a substrate(110). A molding material(130) is spread on the top of the substrate including the external surface of the LED chip. An encapsulating material(140) is spread on the lower part of substrate. A through hole is formed on the central part of the substrate. The LED chip is settled on the upper part of the penetration hole. The substrate is composed of the light transmitting quality.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过直接在发光二极管器件的表面上涂布荧光材料来提高发光效率。 构成：将LED芯片（120）安装在基板（110）的上部。 成型材料（130）被扩散在包括LED芯片的外表面的基板的顶部上。 封装材料（140）扩散在基板的下部。 在基板的中央部形成有通孔。 LED芯片沉入穿孔的上部。 基板由透光质量组成。
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公开(公告)号：KR1020100058769A
公开(公告)日：2010-06-04
申请号：KR1020080117298
申请日：2008-11-25
Applicant: 삼성전자주식회사
IPC: H01L33/56
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to overcome limitation of appearance and design of the light emitting diode package by forming a thin film on the top of the package mold and covering the original color of fluorescent substance. CONSTITUTION: A pair of lead frames(110) is prepared. A package mold(120) comprises a molding material filling space. An LED chip(130) is mounted on the lead frame inside the package mold. A thin film(160) opens and shuts the molding material fill space of the package mold. A molding material(150) is filled in the molding material filling space of the package mold.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过在封装模具的顶部形成薄膜并覆盖荧光物质的原始颜色来克服对发光二极管封装的外观和设计的限制。 构成：准备一对引线框架（110）。 包装模具（120）包括模制材料填充空间。 LED芯片（130）安装在封装模具内的引线框架上。 薄膜（160）打开并关闭包装模具的成型材料填充空间。 成型材料（150）填充在包装模具的成型材料填充空间中。
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公开(公告)号：KR1020090055961A
公开(公告)日：2009-06-03
申请号：KR1020070122863
申请日：2007-11-29
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: A light emitting diode package and a method of manufacturing the same are provided to make the color distribution of a phosphor powder while obtaining uniform brightness distribution through a wide operation angle. A reflector(100) is made of a material having a high reflection coefficient, and an electrode(110) received inside the reflector and a part of the electrode is exposed to the outside through the reflector. An LED chip(120) is mounted on the surface of the reflector positioned between an exposed part of the electrode and the electrode. The LED chip and electrode are connected through an electrode connecting unit(130) which is received in the reflector. An encapsulant including a phosphor powder in order to cover the LED chip on the reflector is injection-molded.
Abstract translation: 提供一种发光二极管封装及其制造方法，以在通过宽的操作角度获得均匀的亮度分布的同时进行荧光体粉末的颜色分布。 反射器（100）由具有高反射系数的材料制成，并且电极（110）容纳在反射器内部，并且电极的一部分通过反射器暴露于外部。 LED芯片（120）安装在反射器的位于电极的暴露部分和电极之间的表面上。 LED芯片和电极通过接收在反射器中的电极连接单元（130）连接。 包含荧光体粉末以便覆盖反射器上的LED芯片的密封剂被注射成型。
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Patent Agency Ranking
公开(公告)号：KR1020120050282A
公开(公告)日：2012-05-18
申请号：KR1020100111706
申请日：2010-11-10
Applicant: 삼성전자주식회사
CPC classification number: H01L33/507 , H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package and a manufacturing method thereof are provided to prevent color deviation by using a fluorescent film instead of a molding resin. CONSTITUTION: A light emitting device(13) is arranged on one or more upper sides of first and second electrodes(11,12). A reflection wall(15) is arranged on the upper side of the first and the second electrodes. The reflection wall forms a mount area surrounding around the light emitting device. A fluorescent film(16) is arranged on the reflection wall. The fluorescent film covers a top portion of the mount area.
Abstract translation: 目的：提供一种发光器件封装及其制造方法，以通过使用荧光膜代替模制树脂来防止颜色偏差。 构成：发光器件（13）布置在第一和第二电极（11,12）的一个或多个上侧上。 反射壁（15）布置在第一和第二电极的上侧。 反射壁形成围绕发光器件的安装区域。 荧光膜（16）设置在反射壁上。 荧光膜覆盖安装区域的顶部。
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公开(公告)号：KR1020110131545A
公开(公告)日：2011-12-07
申请号：KR1020100051024
申请日：2010-05-31
Applicant: 삼성전자주식회사
CPC classification number: H01L33/502 , H01L21/78 , H01L33/483 , H01L33/52 , H01L33/60
Abstract: PURPOSE: A light emitting device package and a manufacturing method thereof are provided to minimize light efficiency degradation by improving a color dispersion property with the dispersibility of a fluorescent substance. CONSTITUTION: A mounting area(10) includes an electrode terminal(11) on the surface. A light emitting device(12) is electrically connected to the electrode terminal. A cover part(20) is included on the mounting area to cover ad seal the light emitting device. A photo converter(30) contains a fluorescent substance and is filled in a cavity(21). A reflecting part(40) reflects light which is from the light emitting device.
Abstract translation: 目的：提供一种发光器件封装及其制造方法，以通过提高具有荧光物质分散性的色散特性来最小化光效降低。 构成：安装区域（10）包括表面上的电极端子（11）。 发光器件（12）电连接到电极端子。 在安装区域上包括盖部件（20），以覆盖广告密封发光装置。 光转换器（30）包含荧光物质并填充在空腔（21）中。 反射部（40）反射来自发光元件的光。
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公开(公告)号：KR1020100122710A
公开(公告)日：2010-11-23
申请号：KR1020090041738
申请日：2009-05-13
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: PURPOSE: A light emitting package is provided to improve reliability by using an encapsulation unit with high heat resistance and color-fastness. CONSTITUTION: First and second electrode terminals(102,103) are electrically connected to a light emitting device(101). An encapsulation unit(104) encapsulates the light emitting device for protection and is made of organically reformed silicon. The organic reformed silicon is comprised by combining organic radical between Si and O.
Abstract translation: 目的：提供一种发光封装，通过使用具有高耐热性和耐色牢度的封装单元来提高可靠性。 构成：第一和第二电极端子（102,103）电连接到发光器件（101）。 封装单元（104）封装用于保护的发光器件，并由有机重整的硅制成。 有机重整的硅通过在Si和O之间结合有机基团而组成。
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公开(公告)号：KR1020100096374A
公开(公告)日：2010-09-02
申请号：KR1020090015220
申请日：2009-02-24
Applicant: 삼성전자주식회사
CPC classification number: H05B33/04 , C08G59/306 , C08G59/3281 , C08L63/00 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PURPOSE: A sealing composition for a light emitting device, and the light emitting device using thereof are provided to secure the excellent light transmittivity by having advantages of a silicone resin and an epoxy resin. CONSTITUTION: A sealing composition for a light emitting device contains a silicon epoxy compound resin. The silicon epoxy compound resin includes a silicon resin with more than one silicon atom bond hydroxy group, and an epoxy resin with more than one oxylane group. The hydroxy group of the silicon resin and the oxylane group of the epoxy resin are chemically bonded to each other.
Abstract translation: 目的：提供一种用于发光器件的密封组合物及其使用的发光器件，以通过硅树脂和环氧树脂的优点来确保优异的透光性。 构成：用于发光装置的密封组合物含有硅环氧化合物树脂。 硅环氧化合物树脂包括具有多于一个硅原子键羟基的硅树脂和具有多于一个氧杂环氧基的环氧树脂。 硅树脂的羟基和环氧树脂的氧杂环氧基彼此化学键合。
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公开(公告)号：KR1020090051508A
公开(公告)日：2009-05-22
申请号：KR1020070117934
申请日：2007-11-19
Applicant: 삼성전자주식회사
Abstract: 본 발명은 지향각을 향상시킬 수 있는 백색 발광소자 및 그 제조방법에 관한 것으로, 두개의 전극패턴이 형성된 하부기판; 상기 하부기판 상에 실장되는 발광소자 칩; 상기 발광소자 칩의 좌우측 오픈시키며, 상기 발광소자 칩의 전후측에 각각 반사면을 갖는 상부기판; 및 상기 발광소자 칩 상부에, 형광체를 포함하는 봉지재를 포함하여 구성된 백색 발광소자 및 그 제조방법을 제공한다.
백색 발광소자, 형광체, 지향각, 색 균일도, 색 재현성
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