公开(公告)号：KR100460957B1

公开(公告)日：2004-12-09

申请号：KR1020020050640

申请日：2002-08-26

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: B23K35/363

Abstract: PURPOSE: A soldering flux of a lead-free alloy is provided to prevent a welding fault by improving a dispersion property of the soldering flux in match with a melting point and fluidity of a lead-free solder. CONSTITUTION: A soldering flux of a lead-free alloy includes 0.01 to 5.0 weight percent of pyridine bromine salt, 0.01 to 5.0 weight percent of guanidine bromine salt, 0.1 to 8.0 weight percent of gum rosin, 0.01 to 5.0 weight percent of synthetic rosin, 0.01 to 5.0 weight percent of fatty acid, industrial alcohol, 0.1 to 8.0 weight percent of disproportionated rosin, 0.01 to 5.0 weight percent of maleic degenerated rosin, and 0.01 to 5.0 weight percent of ethyl amine bromine salt. An Sn-Cu-Ni-P based lead-free alloy solder is used for the soldering flux.

Abstract translation: 目的：提供一种无铅合金的助焊剂，通过改善助焊剂的分散性与无铅焊料的熔点和流动性相匹配来防止焊接缺陷。 构成：无铅合金的助焊剂包括0.01-5.0重量％的吡啶溴盐，0.01-5.0重量％的胍溴盐，0.1-8.0重量％的松香，0.01-5.0重量％的合成松香， 0.01-5.0重量％的脂肪酸​​，工业醇，0.1-8.0重量％的歧化松香，0.01-5.0重量％的马来酸化松香和0.01-5.0重量％的乙基胺溴盐。 Sn-Cu-Ni-P系无铅合金焊料用于助焊剂。

公开(公告)号：KR1020140056826A

公开(公告)日：2014-05-12

申请号：KR1020120122824

申请日：2012-11-01

Applicant: 삼성전자주식회사

Inventor： 김동욱 ,  성백기

IPC: F21V19/00 ,  F21V29/00

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2113/10 ,  F21Y2115/10

Abstract: The disclosed light emitting device according to the present invention includes at least one light emitting unit which emits light, a body unit which supports at least one light emitting unit, and a heat discharge unit which supports at least one light emitting unit and discharges heat. The heat discharge unit with a horn shape is installed on the body unit to slantingly support at least one light emitting unit. Economic efficiency is improved by the improvement of luminous efficiency by suppressing the shadow zone of the light by improving the orientation angle of the light according to the above configuration.

Abstract translation: 根据本发明的公开的发光器件包括至少一个发光的发光单元，支撑至少一个发光单元的主体单元和支持至少一个发光单元并放热的放热单元。 具有喇叭形状的放热单元安装在主体单元上以倾斜地支撑至少一个发光单元。 通过根据上述结构改善光的取向角，通过抑制光的阴影区域来提高发光效率来提高经济效率。

公开(公告)号：KR100776262B1

公开(公告)日：2007-11-15

申请号：KR1020060108268

申请日：2006-11-03

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: H01L21/60 ,  H05K3/34

Abstract: An automatic soldering apparatus is provided to control separately a transfer speed of a printed circuit board in a preheating section and a soldering section by separately controlling first and second conveyors, and to control a transfer speed of the first and second conveyors without lengthening an entire length of the automatic soldering apparatus. An automatic soldering apparatus includes a preheating unit(30) for preheating a printed circuit board(1), a soldering unit(40) for soldering the printed circuit board, and a conveyor for transferring the printed circuit board from a preheating section to a soldering section. The conveyor has a first conveyor(60) installed in the preheating section and a second conveyor(70) installed in the soldering section and controlled independent of the first conveyor.

Abstract translation: 提供一种自动焊接装置，用于通过分别控制第一和第二输送机分别控制预热部分和焊接部分中的印刷电路板的传送速度，并且控制第一和第二输送机的传送速度，而不会延长整个长度 的自动焊接装置。 一种自动焊接装置，包括用于预热印刷电路板（1）的预热单元（30），用于焊接印刷电路板的焊接单元（40），以及用于将印刷电路板从预热部分转移到焊接 部分。 输送机具有安装在预热部分中的第一输送机（60）和安装在焊接部分中并独立于第一输送机控制的第二输送机（70）。

公开(公告)号：KR1020060060344A

公开(公告)日：2006-06-05

申请号：KR1020040099392

申请日：2004-11-30

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: B23K3/00 ,  B23K1/00 ,  B23K3/08

Abstract: 본 발명은 무연 솔더를 이용한 납땜 공정에 적용하기 위한 자동납땜기의 납조 구조에 관한 것이다.
본 발명에 따른 자동납땜기는 납땜을 촉진하기 위한 플럭스조, 플럭스가 도포된 인쇄회로기판을 예열하는 예열조 및 예열된 인쇄회로기판에 용융된 솔더를 공급하는 납조를 구비하는 자동납땜기에 있어서, 상기 납조에는 1차 납땜과 2차 냅땜 사이의 솔더 응고 및 1차솔더 주위의 크랙발생을 방지할 수 있도록 1차노즐과 2차노즐이 인접하여 배치된 것을 특징으로 한다.
자동납땜기, 무연솔더

公开(公告)号：KR1020070021817A

公开(公告)日：2007-02-23

申请号：KR1020050076493

申请日：2005-08-19

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: H05K3/34

CPC classification number: B23K1/008 ,  B23K2201/42 ,  H05K3/3494 ,  H05K2203/111 ,  H05K2203/1509

Abstract: 본 발명에 의한 솔더링 장치는, 전자부품이 장착된 상태로 진입되어 온 인쇄회로기판(P)을 운반하기 위한 예열 콘베이어 벨트(11)와, 예열 콘베이어 벨트(11)에 탑재되어 운반되는 인쇄회로기판(P)을 예열시키기 위한 예열 히터(15)(16)(17)와, 예열이 완료된 인쇄회로기판(P)을 운반하기 위해 예열 콘베이어 벨트(11)에 인접하게 설치되는 솔더링 콘베이어 벨트(21)와, 솔더링 콘베이어 벨트(21)에 탑재되어 운반되는 인쇄회로기판(P)을 솔더링 하기 위한 솔더링 수단(25)(26)을 포함하며, 예열 콘베이어 벨트(11)와 솔더링 콘베이어 벨트(21)의 주행속도가 서로 다르다.

公开(公告)号：KR1020050030237A

公开(公告)日：2005-03-29

申请号：KR1020040092857

申请日：2004-11-13

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: B23K35/22

CPC classification number: B23K35/262 ,  C22C13/00 ,  H05K3/3463

Abstract: A lead-free solder alloy is provided to lower the melting point and improve wettability or binding strength for preventing a bridge and to differentiate alloy content ratio of the Sn(Stannum)-Ag(Silver) lead-free solder alloy according to heat resistance of an object to be coated, such as phenol or epoxy for a PCB(Printed Circuit Board) material, a component-elementary lead, an availability printed circuit, and a wire-bonding or according to whether nitrogen is included in the facility while soldering. A Sn-Ag lead-free solder alloy includes from 0.1 to 3.0 wt% of Cu(Copper), from 0.01 to 0.5 wt% of Ni(Nickel), and from 0.1 to 5.0 wt% of Ag(Sn-Cu-Ag-Ni). Other possibilities of the content ratio of the Sn-Ag lead-free solder alloy are as follow: the Cu of from 0.3 to 0.8 wt%, the Ni of from 0.01 to 0.1 wt%, and the Ag of from 0.1 to 0.5 wt%; the Cu of from 0.3 to 0.8 wt%, the Ni of from 0.01 to 0.1 wt%, and the Ag of from 0.2 to 4.0 wt%; the Cu of from 2.1 to 2.5 wt%, the Ni of from 0.01 to 0.1 wt%, and the Ag of from 0.1 to 0.5 wt%; the Cu of from 2.1 to 2.5 wt%, the Ni of from 0.01 to 0.1 wt%, and the Ag of from 2.8 to 3.2 wt%; and one of the above possibilities additionally with from 0.003 to 0.01 wt% of P(Phosphorus)(Sn-Cu-Ag-Ni-0.004, 0.006, 0.008, or 0.01P). The Cu of from 0.3 to 0.8 wt% is the optimum, but Cu more then 0.9 wt% increases the melting point. If the Ag of 3.0 wt% is added to the Sn, the melting point decreases and the wettability and binding strength are improved to elevate solder to a through-hole at an epoxy PCB material. The addition of from 0.1 to 0.5 wt% Ag is the optimum in using phenol, whereas from 2.0 to 4.0 wt% Ag is the optimum in using epoxy. The wettability changes according to the Ni contents. The addition of the P minimizes a dross at a bath pot and prevents a bridge.

Abstract translation: 提供无铅焊料合金，以降低熔点，提高防止桥的润湿性或结合强度，并根据耐热性对Sn（锡）-Ag（银）无铅焊料合金的合金含量比进行区分 用于PCB（印刷电路板）材料的涂层物体，例如苯酚或环氧树脂，组分基本导线，可用性印刷电路和引线接合，或根据焊接期间是否包含氮气。 Sn-Ag无铅焊料合金包含0.1〜3.0重量％的Cu（铜），0.01〜0.5重量％的Ni（镍）和0.1〜5.0重量％的Ag（Sn-Cu-Ag- Ni）等。 Sn-Ag无铅焊料合金的含量比的其他可能性如下：Cu为0.3〜0.8重量％，Ni为0.01〜0.1重量％，Ag为0.1〜0.5重量％ ; Cu为0.3〜0.8重量％，Ni为0.01〜0.1重量％，Ag为0.2〜4.0重量％。 Cu为2.1〜2.5重量％，Ni为0.01〜0.1重量％，Ag为0.1〜0.5重量％。 Cu为2.1〜2.5重量％，Ni为0.01〜0.1重量％，Ag为2.8〜3.2重量％。 另外还有一种上述可能性，另外还有磷（Phosphorus）（Sn-Cu-Ag-Ni-0.004,0.006,0.008,0.01P）0.003-0.01wt％。 0.3〜0.8重量％的Cu是最佳的，但是Cu大于0.9重量％则熔点增加。 如果将3.0重量％的Ag添加到Sn中，则熔点降低，并且润湿性和粘合强度得到改善，从而将焊料提升到环氧树脂PCB材料上的通孔。 添加0.1至0.5重量％的Ag是使用苯酚的最佳方式，而2.0至4.0重量％的Ag是使用环氧树脂的最佳选择。 润湿性根据Ni含量而变化。 添加P可以最大限度地减少沐浴露上的浮渣并防止桥梁。

公开(公告)号：KR1020030075373A

公开(公告)日：2003-09-26

申请号：KR1020020014555

申请日：2002-03-18

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: B23K35/26

Abstract: PURPOSE: Lead-free solder alloy is provided to improve the strength of a soldered part by repressing the generation of oxidation and to suppress the generation of thread bridges by improving dispersion. CONSTITUTION: Lead-free solder alloy to mount electric components to a PCB(Printed Circuit Board) is composed by 0.05¯2.0 weight percent of cuprum, 0.001¯2.0 weight percent of nickel, 0.001¯1.0 weight percent of phosphorus, and stannum composing the rest thereof, excluding plumbum. Therefore, the lead-free solder alloy improves the rigidity of solder by suppressing the reaction of oxidized substances by adding a little of phosphorus to the existing Cu-Ni-Sn ternary lead-free solder alloy, stress resistance for enduring the thermal stress and vibration of the soldered part, considerably reduce the defects of the soldering by improving flowability, and supplies environment friendly solder alloy by completely excluding plumbum.

Abstract translation: 目的：提供无铅焊料合金，以通过抑制氧化产生来提高焊接部件的强度，并通过改善分散性来抑制螺纹桥的产生。 构成：将电子部件安装到PCB（印刷电路板）上的无铅焊料合金由0.05〜2.0重量百分比的铜，0.001〜2.0重量％的镍，0.001〜1.0重量％的磷和锡组成， 其余的，不包括铅。 因此，无铅焊料合金通过在现有的Cu-Ni-Sn三元无铅焊料合金中添加少量的磷来抑制氧化物质的反应，从而提高焊料的刚性，耐热应力和振动的耐应力 的焊接部件，通过提高流动性大大降低了焊接的缺陷，并且通过完全排除铅垂提供环境友好的焊料合金。

公开(公告)号：KR1020140065493A

公开(公告)日：2014-05-30

申请号：KR1020120129205

申请日：2012-11-15

Applicant: 삼성전자주식회사

Inventor： 김동욱 ,  성백기

IPC: F21S2/00 ,  H05K1/02 ,  F21V29/00

CPC classification number: F21K9/20 ,  F21K9/235 ,  F21V5/007 ,  F21V19/0025 ,  F21V29/70 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/62 ,  H01L2924/12041 ,  H05K2201/10106

Abstract: A PCB for a lamp is disclosed. According to an embodiment of the present invention, the PCB for a lamp may include: a metal layer which a circuit pattern is formed and a light emitting device is mounted on; an insulating layer provided on the lower part of the metal layer; and at least one air flowing hole which penetrates the metal layer and the insulating layer.

Abstract translation: 公开了一种用于灯的PCB。 根据本发明的实施例，用于灯的PCB可以包括：形成电路图案的金属层和安装有发光器件; 设置在金属层的下部的绝缘层; 以及穿透金属层和绝缘层的至少一个空气流通孔。

公开(公告)号：KR1020130065995A

公开(公告)日：2013-06-20

申请号：KR1020110132639

申请日：2011-12-12

Applicant: 삼성전자주식회사

Inventor： 김동욱 ,  성백기

IPC: F21S2/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: F21K9/275 ,  F21S2/005 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: PURPOSE: A lighting device is provided to obtain 360 degree beam-raider angle by a simple structure. CONSTITUTION: A light emitting unit(130) comprises a printed circuit board(132) in which many light emitting devices(134) are installed. Heat radiating units(140) are arranged along the circumference of an outer side of the light emitting unit and spaced from each other to emit beams to different directions. The heat radiating unit(140) emits heat to outside. The heat radiating unit(140) emits heat from the light emitting unit to outside. The light emitting units(130) are arranged in the heat radiating unit to be overlapped with each other.

Abstract translation: 目的：提供照明装置，通过简单的结构获得360度的射束角。 构成：发光单元（130）包括其中安装许多发光装置（134）的印刷电路板（132）。 散热单元（140）沿着发光单元的外侧的圆周布置并且彼此间隔开以向不同的方向发射波束。 散热单元（140）向外部发热。 散热单元（140）从发光单元向外部发热。 发光单元（130）布置在热辐射单元中以彼此重叠。

公开(公告)号：KR100454486B1

公开(公告)日：2004-10-28

申请号：KR1020040059001

申请日：2004-07-28

Applicant: 삼성전자주식회사

Inventor： 성백기

IPC: B23K35/26

Abstract: PURPOSE: An electronic equipment and a PCB are provided to increase the strength of solder and achieve improved stress resistance by soldering electronic components or circuit through the use of 4-element solder alloy. CONSTITUTION: An electronic equipment comprises a plurality of electronic components soldered by a solder alloy consisting of Cu 0.005 to 2.0 weight%, Ni 0.001 to 2.0 weight%, P 0.001 to 1.0 weight%, and a remainder Sn. The electronic equipment is a digital video camera-recorder or a digital television.

Abstract translation: 目的：提供电子设备和PCB以增加焊料的强度，并通过使用4元素焊料合金焊接电子元件或电路来提高应力耐受性。 一种电子设备，其特征在于，具有由焊料合金焊接的多个电子部件，所述焊料合金由Cu：0.005〜2.0重量％，Ni：0.001〜2.0重量％，P：0.001〜1.0重量％，余量为Sn。 电子设备是数字视频摄像机或数字电视。