公开(公告)号：KR100653645B1

公开(公告)日：2006-12-05

申请号：KR1020050130950

申请日：2005-12-27

Applicant: 삼성전자주식회사

Inventor： 아더다비니안 ,  최승태 ,  권기환 ,  문창렬 ,  신규호

IPC: H01L33/64

Abstract: An LED(light emitting diode) package and a method for fabricating the LED package is provided to be used in a cellular phone or other portable electronic products by simplifying and miniaturizing the structure of an LED package. An electrode pattern is formed on the bottom surface of a transparent cover(110). A light emitting diode(140) is installed in the bottom surface of the transparent cover, electrically connected to an external circuit through the electrode pattern. The light emitting diode is fixed to the bottom surface of the transparent cover by fixing resin. A metal slug(160) is formed in the lower part of the fixing resin to radiate heat. The transparent cover includes a plane-convex lens positioned on the light emitting diode.

Abstract translation: 通过简化和小型化LED封装的结构，提供LED（发光二极管）封装和用于制造LED封装的方法以用于蜂窝电话或其他便携式电子产品中。 电极图案形成在透明盖（110）的底表面上。 发光二极管（140）安装在透明盖的底表面中，通过电极图案电连接到外部电路。 通过固定树脂将发光二极管固定在透明盖的底面上。 金属嵌条（160）形成在固定树脂的下部以散发热量。 透明盖包括位于发光二极管上的平面凸透镜。