公开(公告)号：KR101767663B1

公开(公告)日：2017-08-16

申请号：KR1020120080715

申请日：2012-07-24

Applicant: 삼성전자주식회사 ,  세메스 주식회사

Inventor： 이영철 ,  권세민 ,  이진환 ,  오제묵 ,  이경숙 ,  이남홍

IPC: G01R31/28 ,  G01R1/04

Abstract: 본발명은기판을제조하는장치를제공한다. 기판제조설비는기판에대해검사공정을수행하는테스트핸들러모듈을가지는검사장치를포함한다. 상기테스트핸들러모듈은기판을반송하는컨베이어유닛, 기판에대해상기검사공정을수행하는핸들러유닛, 상기컨베이어유닛과상기핸들러유닛간에기판을반송하는반송유닛을포함할수 있다. 상기컨베이어유닛은공급컨베이어와상기공급컨베이어로부터이격된배출컨베이어를가질수 있다.

公开(公告)号：KR1020130111915A

公开(公告)日：2013-10-11

申请号：KR1020120080715

申请日：2012-07-24

Applicant: 삼성전자주식회사 ,  세메스 주식회사

Inventor： 이영철 ,  권세민 ,  이진환 ,  오제묵 ,  이경숙 ,  이남홍

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2601 ,  G01R1/0408 ,  G01R31/2808 ,  G01R31/2862 ,  G01R31/2863 ,  G01R31/2867

Abstract: PURPOSE: A circuit board manufacturing facility including a testing device and a circuit board manufacturing method thereof are provided to effectively execute a circuit testing process. CONSTITUTION: A testing device includes a test handler module (1300). The test handler module executes an inspection process for a circuit board. The test handler module includes a conveyor unit (1400), a handler unit (1600), and a carriage unit (1500). The conveyor unit includes a supply conveyor (1420) and a discharge conveyor (1430). The discharge conveyor is separated from the supply conveyor. The handler unit executes an inspection process for the circuit board. The carriage unit returns the circuit board between the conveyor unit and the handler unit.

Abstract translation: 目的：提供包括测试装置和电路板制造方法的电路板制造设备，以有效地执行电路测试过程。 规定：测试装置包括测试处理程序模块（1300）。 测试处理程序模块执行电路板的检查过程。 测试处理模块包括输送单元（1400），处理单元（1600）和托架单元（1500）。 输送机单元包括供料输送机（1420）和排料输送机（1430）。 排放输送机与供应输送机分离。 处理器单元执行电路板的检查处理。 托架单元将输送单元和处理单元之间的电路板返回。

公开(公告)号：KR102002982B1

公开(公告)日：2019-07-24

申请号：KR1020130005493

申请日：2013-01-17

Applicant: 삼성전자주식회사

Inventor： 이영철 ,  이남홍 ,  이경숙 ,  박정현 ,  이상열

IPC: G01R31/28 ,  H01L21/66

公开(公告)号：KR1020140093817A

公开(公告)日：2014-07-29

申请号：KR1020130005493

申请日：2013-01-17

Applicant: 삼성전자주식회사

Inventor： 이영철 ,  이남홍 ,  이경숙 ,  박정현 ,  이상열

IPC: G01R31/28 ,  H01L21/66

CPC classification number: G01R31/2867 ,  G01R31/287 ,  G01R31/2893 ,  G01R31/2894

Abstract: The present invention relates to equipment for testing a semiconductor device and method of testing the semiconductor device using the same. The method of testing the semiconductor device includes the steps of: loading a paneled PCB including unit PCBs, each of which has a semiconductor device mounted thereon, on test equipment; checking product information on the paneled PCB loaded on the test equipment; electrically connecting the paneled PCB that the product information is checked to one of main testers, each of which includes a main test interface directly connected to a cloud server in which multiple types of firmware for various kinds of tests are stored, in the test equipment; delivering the product information on the paneled PCB to the main tester electrically connected to the paneled PCB; requesting a main test for the paneled PCB using the product information from the main tester receiving the product information; and unloading the paneled PCB that the main test is completed by the main tester from the test equipment.

Abstract translation: 本发明涉及一种用于测试半导体器件的设备及其使用该半导体器件的半导体器件的测试方法。 测试半导体器件的方法包括以下步骤：在测试设备上装载包括其中安装有半导体器件的单元PCB的镶板PCB; 检查装在测试设备上的镶板PCB上的产品信息; 电气连接面板PCB，将产品信息检查到主测试器之一，每个主测试器包括直接连接到云服务器的主测试接口，其中存储用于各种测试的多种类型的固件;在测试设备中; 将面板PCB上的产品信息传递到电连接到面板PCB的主测试仪; 使用主测试者收到产品信息的产品信息，请求面板PCB的主要测试; 并卸下主要测试由主测试仪从测试设备完成的镶板PCB。