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公开(公告)号:KR100689664B1
公开(公告)日:2007-03-08
申请号:KR1020050083285
申请日:2005-09-07
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: An apparatus for cleaning a wafer is provided to prevent a used cleaning solution from being fed back to the surface of a wafer by ascending air current caused by vortex generated by rotation of a rotation chuck by including a protrusion part with a slope from the lateral surface of the rotation chuck and by having a blocking part extended from a guide for avoiding scattering of a cleaning solution. A rotation chuck(110) supports and rotates a wafer(W). A cleaning solution supplying part supplies a cleaning solution to the wafer. A bowl(160) surrounds the rotation chuck, separated from the rotation chuck. A protrusion part(120) is formed in the circumferential direction of the rotation chuck to avoid ascending air current caused by vortex generated between the rotation chuck and the bowl by rotation of the rotation chuck, having a first slope(121) and a second slope(122). The first slope is tilted outward and downward from the upper surface of the rotation chuck. The second slope is tilted outward and upward from the lower surface of the rotation chuck. The area of the first slope is not greater than that of the second slope.
Abstract translation: 提供了一种用于清洁晶片的设备,以通过从侧表面包括具有斜面的突出部分来防止已用清洁溶液通过由旋转卡盘的旋转产生的旋涡引起的上升气流而被反馈回晶片的表面 并且通过具有从导向件延伸的阻挡部分来避免清洁溶液的散射。 旋转卡盘(110)支撑并旋转晶片(W)。 清洁溶液供应部件向晶片供应清洁溶液。 碗(160)围绕旋转卡盘,与旋转卡盘分离。 在旋转卡盘的圆周方向上形成有突出部(120),以避免由于旋转卡盘的旋转而在旋转卡盘和转筒之间产生的涡流引起的上升气流,所述旋转卡盘具有第一斜面(121)和第二斜面 (122)。 第一斜面从旋转卡盘的上表面向外并向下倾斜。 第二斜面从旋转卡盘的下表面向外并向上倾斜。 第一斜坡的面积不大于第二斜坡的面积。
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公开(公告)号:KR1020040085245A
公开(公告)日:2004-10-08
申请号:KR1020030019878
申请日:2003-03-31
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/304
Abstract: PURPOSE: A wafer dry apparatus for a spin dryer and a driving method thereof are provided to prevent a breaking phenomenon of a wafer by removing a rinsing solution from the wafer in a low-speed rotating state of a spin motor. CONSTITUTION: A controller(30) removes residual liquid from a surface of a wafer by injecting a cleaning gas onto the wafer. A vacuum chuck(34) is used for absorbing and supporting the wafer and rotating the wafer. A plurality of injection nozzles(38a,38b) are used for injecting deionized water onto the wafer according to a control command of the controller. A rotary unit(32) changes rotatory power of the vacuum chuck according to the control command of the controller. A gas supply source(50) is used for supply a cleaning gas. A gas pressure gauge(52) is used for measuring, controlling, and displaying the pressure of the cleaning gas. An air valve(54) is used for supplying or interrupting the cleaning gas. A gas injection nozzle is installed at one end of a gas supply tube in order to remove a rinsing solution from the wafer.
Abstract translation: 目的:提供一种用于旋转干燥器的晶片干燥装置及其驱动方法,以通过在旋转电动机的低速旋转状态下从晶片上除去冲洗溶液来防止晶片的断裂现象。 构成:控制器(30)通过将清洁气体注入到晶片上从晶片的表面去除残余的液体。 真空吸盘(34)用于吸收和支撑晶片并旋转晶片。 根据控制器的控制命令,多个注射喷嘴(38a,38b)用于将去离子水喷射到晶片上。 旋转单元(32)根据控制器的控制命令改变真空吸盘的旋转动力。 供气源(50)用于供应清洁气体。 气压计(52)用于测量,控制和显示清洁气体的压力。 空气阀(54)用于供给或中断清洁气体。 气体注入喷嘴安装在气体供给管的一端,以从晶片上除去漂洗溶液。
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公开(公告)号:KR1020040035084A
公开(公告)日:2004-04-29
申请号:KR1020020063814
申请日:2002-10-18
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/68
Abstract: PURPOSE: A wafer transfer chuck having an electronic wire and semiconductor fabrication equipment having the same are provided to prevent an over-etching phenomenon of a wafer by sensing and exchanging a broken wafer transfer chuck. CONSTITUTION: A wafer transfer chuck having an electronic wire includes a couple of vertical fixing plates(108), a horizontal fixing plate(111), and a wafer fixing plate(105). The horizontal fixing plate is used for connecting a top part of one vertical fixing plate(108) to a top part of the other vertical fixing plate. The wafer fixing plate(105) is used for fixing each bottom part of the vertical fixing plates(108). A plurality of grooves(109) are formed on the wafer fixing plate(105) in order to support a wafer(102). An electric wire is formed in the inside of the wafer fixing plate and the inside of the vertical fixing plates.
Abstract translation: 目的:提供一种具有电子线的晶片转印卡盘和具有该电子线的半导体制造设备,以通过感测和更换破碎的晶片传送卡盘来防止晶片的过蚀刻现象。 构成:具有电子线的晶片转印卡盘包括一对垂直固定板(108),水平固定板(111)和晶片固定板(105)。 水平固定板用于将一个垂直固定板(108)的顶部连接到另一垂直固定板的顶部。 晶片固定板(105)用于固定垂直固定板(108)的每个底部。 为了支撑晶片(102),在晶片固定板(105)上形成有多个凹槽(109)。 在晶片固定板的内部和垂直固定板的内部形成电线。
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公开(公告)号:KR1020040034128A
公开(公告)日:2004-04-28
申请号:KR1020020064206
申请日:2002-10-21
Applicant: 삼성전자주식회사
IPC: H01L21/3063
Abstract: PURPOSE: A wafer wet etching apparatus having an over-etching prevention function is provided to be capable of improving the yield of wafers. CONSTITUTION: A wafer wet etching apparatus includes an equipment control part(404), a chemical bath(301), and a drain pump(308). The chemical bath includes an outer bath(302) having a chemical drain valve(305) for exhausting chemical and an inner bath. At this time, the inner bath includes a chemical source valve(306) for supplying the chemical and a quick drain valve(307) connected with the drain pump for quickly exhausting the chemical. When related equipment malfunctions, an electric signal is transmitted from the equipment control part to the drain pump for operating the drain pump, so that the chemical of the chemical bath is exhausted.
Abstract translation: 目的:提供具有过蚀刻防止功能的晶片湿式蚀刻装置,以能够提高晶片的产量。 构成:晶片湿蚀刻装置包括设备控制部(404),化学浴(301)和排水泵(308)。 化学浴包括具有用于排出化学物质和内浴的化学排泄阀(305)的外浴(302)。 此时,内浴包括用于供给化学品的化学源阀(306)和与排水泵连接的快速排水阀(307),用于快速排出化学品。 当相关设备发生故障时,电气信号从设备控制部分传输到排水泵,用于操作排水泵,使化学浴液的化学物质排出。
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公开(公告)号:KR1020060041365A
公开(公告)日:2006-05-12
申请号:KR1020040090430
申请日:2004-11-08
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/304
CPC classification number: H01L21/67046 , H01L21/67051 , H01L21/67259 , H01L21/68707
Abstract: 본 발명은 웨이퍼를 스핀척상에 올려놓고 고속으로 회전하면서 웨이퍼를 세정하는 스핀 세정 장치에 관한 것으로, 본 발명의 스핀 세정 장치는 웨이퍼가 놓여지는 그리고 웨이퍼 가장자리를 잡아주는 복수의 그립퍼들을 갖는 스핀척과; 상기 웨이퍼가 상기 스핀척의 그립퍼위에 올라탔는지는 감지하는 적어도 하나의 센서부와; 상기 적어도 하나의 센서부로부터 웨이퍼가 그립퍼위에 올라탔다는 신호를 받으면, 스핀척의 구동을 중단시키는 제어부를 포함한다.
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公开(公告)号:KR100639674B1
公开(公告)日:2006-10-30
申请号:KR1020040053157
申请日:2004-07-08
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/02 , H01L21/304
Abstract: 유체공급장치는 적어도 두 개로 된 유체공급원과, 유체공급원으로부터 가스를 공급받아 작용하는 유체작용부와, 유체공급원과 유체작용부를 연결하는 유체라인 및 유체라인 사이에 설치되어 어느 한쪽의 압력이 떨어졌을 때 다른 쪽의 가스를 공급시키는 연결수단을 포함한다.
Abstract translation: 当至少两片之间设置与所述流体源的流体供应和流体作用接收来自流体供应和操作部供给的气体,连接流体源和流体作用和流体管路中的流体管线下降任一个的压力 并提供其他气体的连接装置。
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公开(公告)号:KR1020060044195A
公开(公告)日:2006-05-16
申请号:KR1020040092029
申请日:2004-11-11
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/68
CPC classification number: H01L21/68 , H01L21/68742 , Y10S414/136
Abstract: 본 발명은 푸프 내에 적재된 웨이퍼를 정렬시킬 수 있는 장치에 관한 것으로, 복수매의 웨이퍼를 적재할 수 있는 푸프가 놓여지는 스테이지와; 상기 스테이지 하단에 배치된 구동 장치와; 상기 구동 장치와 상기 스테이지 사이에 배치되어 상기 구동 장치의 동력을 상기 스테이지에 전달하여 상기 스테이지를 소정 각도로 기울이게 하여 상기 푸프 내에 적재된 웨이퍼를 정렬시킬 수 있는 동력 전달 매개체를 포함하는 것을 특징으로 한다. 이에 의하면, 푸프를 업다운시킴으로써 웨이퍼를 올바르게 정렬시킬 수 있게 된다. 따라서, 웨이퍼 정렬이 일정하게 된 상태에서 로봇 암이 웨이퍼를 가져가기 때문에 로봇 암과 웨이퍼가 충돌하여 웨이퍼에 스크랫치가 생기거나 파손되는 일을 없앨 수 있는 효과가 있다.
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公开(公告)号:KR1020050025519A
公开(公告)日:2005-03-14
申请号:KR1020030062861
申请日:2003-09-08
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/00
Abstract: A power supply system of a control apparatus for semiconductor manufacturing equipment is provided to supply incessantly power to a PLC(Programmable Logic Controller) regardless of the malfunction of one power supply by using a plurality of power supplies. A power supply system includes a main power supply(124) for supplying predetermined AC(Alternating Current) power to a PLC(151) for controlling a bit of semiconductor manufacturing equipment and a power supply unit. The power supply unit(152) includes a plurality of power supplies(153,154) interposed between the main power supply and the PLC. The power supplies are used for transforming the predetermined AC power into predetermined DC(Direct Current) power and supplying the predetermined DC power to the PLC.
Abstract translation: 提供了一种用于半导体制造设备的控制装置的电源系统,其通过使用多个电源而不管一个电源的故障而向PLC(可编程逻辑控制器)供应不间断的电力。 电源系统包括用于向PLC(151)提供预定AC(交流)功率以控制半导体制造设备和电源单元的位的主电源(124)。 电源单元(152)包括插在主电源和PLC之间的多个电源(153,154)。 电源用于将预定的AC电力转换成预定的DC(直流)电力并将预定的DC电力提供给PLC。
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公开(公告)号:KR1020040090177A
公开(公告)日:2004-10-22
申请号:KR1020030024122
申请日:2003-04-16
Applicant: 삼성전자주식회사
Inventor: 이덕열
IPC: H01L21/304
Abstract: PURPOSE: A wet station apparatus for fabricating a semiconductor is provided to identify the number of wafers in a fabrication process by using a wafer detection unit. CONSTITUTION: A wet station apparatus includes a chemical bath for storing chemicals, a QDR bath for storing a cleaning agent for cleaning the chemicals, a final rinse bath for cleaning a wafer, a dryer for drying the cleaned wafer, and a wafer transfer robot for transferring the wafer. The wafer transfer robot includes a robot body(181) moved according to each process, a vertical support unit(183) installed at the robot body, a horizontal support unit(184) extended from the vertical support unit, a couple of support members(186,187) for holding selectively the wafer, and a wafer detection unit for identifying the number of wafers.
Abstract translation: 目的:提供一种用于制造半导体的湿站设备,以通过使用晶片检测单元来识别制造工艺中的晶片数量。 构成:湿站装置包括用于储存化学品的化学浴液,用于储存用于清洁化学品的清洁剂的QDR浴,用于清洁晶片的最终漂洗浴,用于干燥清洁的晶片的干燥器,以及用于 转移晶片。 晶片传送机器人包括:机器人本体(181),其根据每个工序移动;安装在机器人主体上的垂直支撑单元(183),从垂直支撑单元延伸的水平支撑单元(184),一对支撑构件 186,187),用于选择性地保持晶片;以及晶片检测单元,用于识别晶片的数量。
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