公开(公告)号：KR1020010027024A

公开(公告)日：2001-04-06

申请号：KR1019990038582

申请日：1999-09-10

Applicant: 삼성전자주식회사

Inventor： 제만호 ,  김민규 ,  조정후

IPC: H01L21/302

Abstract: PURPOSE: A slurry supplying arm of a chemical mechanical polishing(CMP) equipment is provided to improve efficiency of a CMP process and to save slurry, by preventing peripheral equipment from being contaminated by water splash generated when a polishing pad is cleaned with high pressure deionized water through a nozzle in a high pressure deionized water line. CONSTITUTION: Covers are formed in an upper portion and both lengthwise side portions of a slurry supplying arm(39) of a chemical mechanical polishing(CMP) equipment. A slurry and deionized(DI) water supplying line(23) and a high pressure DI water supplying line are installed inside the covers. A cover complementing unit(34) is installed to prevent particles from being generated by water splash.

Abstract translation: 目的：提供化学机械抛光（CMP）设备的浆料供应臂，以提高CMP工艺的效率，并通过防止外围设备被高压去离子水清洗抛光垫时产生的水溅而被污染 水通过喷嘴在高压去离子水管线中。 构成：在化学机械抛光（CMP）设备的浆料供给臂（39）的上部和纵向侧部形成有盖。 在盖内安装有浆料和去离子（DI）给水管线（23）和高压DI给水管线。 安装盖补充单元（34）以防止水飞溅产生颗粒。