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公开(公告)号：KR101922118B1
公开(公告)日：2018-11-26
申请号：KR1020120093884
申请日：2012-08-27
Applicant: 삼성전자주식회사
CPC classification number: H01L31/03044 , B82Y20/00 , H01L25/0753 , H01L31/035218 , H01L31/035236 , H01L31/03529 , H01L31/047 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0075 , H01L33/0079 , H01L33/24 , H01L33/32 , H01L33/56 , H01L2924/0002 , Y02E10/544 , Y02P70/521 , H01L2924/00
Abstract: 플렉서블반도체소자및 그제조방법에관해개시되어있다. 개시된플렉서블반도체소자는플렉서블물질층내에임베드(embed)된적어도하나의수직형반도체요소를포함할수 있다. 상기플렉서블반도체소자는상기플렉서블물질층의제1면상에구비된제1전극및 상기플렉서블물질층의제2면상에구비된제2전극을더 포함할수 있다. 개시된플렉서블반도체소자의제조방법은하지층과버퍼층사이의열팽창계수차이를이용해서이들의접착력을약화시킴으로써, 수직형반도체요소가임베드(embed)된플렉서블물질층을기판으로부터분리하는단계를포함할수 있다.
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公开(公告)号：KR1020170108342A
公开(公告)日：2017-09-27
申请号：KR1020160032067
申请日：2016-03-17
Applicant: 삼성전자주식회사
IPC: H05B33/18 , H05B33/26 , H05B33/20 , H01L33/06 , H01L33/50 , H01L51/50 , H01L21/02 , B82B1/00 , B82Y20/00
CPC classification number: H01L51/502 , H01L51/504 , H01L51/5056 , H01L51/5072 , H01L51/5088
Abstract: 발광층내에배치된코어쉘구조의나노입자들에서발생하는플라즈몬공명에의해발광효율이향상된발광소자가개시된다. 개시된발광소자는, 제 1 전극구조체, 제 1 전극구조체위에배치된발광층, 발광층위에배치된제 2 전극구조체, 및발광층의내부에배치된다수의나노입자를포함하며, 각각의나노입자는플라즈몬공명을일으키도록금속코어및 금속구조를둘러싸는유전체쉘을포함할수 있다.
Abstract translation: 公开了一种由于在设置在发光层中的核壳结构的纳米颗粒中产生的等离子体共振而具有增强的发光效率的发光装置。 所公开的发光装置中，第一电极结构，发光层，设置在所述第二电极结构的内部，以及设置在发光层的发光层包括多个纳米颗粒，设置在第一电极结构中的每个纳米颗粒等离子体激元共振， 以及围绕金属芯和金属结构的电介质外壳。
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Patent Agency Ranking
公开(公告)号：KR1020140027811A
公开(公告)日：2014-03-07
申请号：KR1020120093884
申请日：2012-08-27
Applicant: 삼성전자주식회사
CPC classification number: H01L31/03044 , B82Y20/00 , H01L25/0753 , H01L31/035218 , H01L31/035236 , H01L31/03529 , H01L31/047 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0075 , H01L33/0079 , H01L33/24 , H01L33/32 , H01L33/56 , H01L2924/0002 , Y02E10/544 , Y02P70/521 , H01L2924/00
Abstract: Disclosed are a flexible semiconductor device and a method of manufacturing the same. The disclosed flexible semiconductor device may include at least one vertical semiconductor element that is embedded in a flexible material layer. The flexible semiconductor device may further include a first electrode formed on a first surface of the flexible material layer and a second electrode formed on a second surface of the flexible material layer. The disclosed method of manufacturing the flexible semiconductor device may include the step of separating the flexible material layer, in which the vertical semiconductor element is embedded, from a substrate by weakening or degrading an adhesive force between an under layer and a buffer layer by using a difference in coefficients of thermal expansion of the under layer and the buffer layer.
Abstract translation: 公开了一种柔性半导体器件及其制造方法。 所公开的柔性半导体器件可以包括嵌入在柔性材料层中的至少一个垂直半导体元件。 柔性半导体器件还可以包括形成在柔性材料层的第一表面上的第一电极和形成在柔性材料层的第二表面上的第二电极。 所公开的制造柔性半导体器件的方法可以包括以下步骤：通过使底层和缓冲层之间的粘合力的弱化或降低，将衬底中的垂直半导体元件的柔性材料层与衬底分离 底层和缓冲层的热膨胀系数差异。
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7.发明公开마이크로 히터 어레이, 이를 이용한 ｐｎ 접합 형성방법,및 마이크로 히터 어레이 및 ｐｎ 접합을 포함하는 ｐｎ접합 소자 无效微加热器阵列，用于制造使用其的PN结的方法以及具有微加热器阵列和PN结的PN结装置
公开(公告)号：KR1020090102031A
公开(公告)日：2009-09-30
申请号：KR1020080027233
申请日：2008-03-25
Applicant: 삼성전자주식회사
IPC: H01L23/34 , G01F1/68 , H01L29/8605 , B82Y30/00
CPC classification number: C30B35/00 , H01L21/02532 , H01L21/0254 , H01L21/02573 , H01L21/02603 , H01L21/02606 , H01L33/007 , H01L33/18 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A micro heater array, a pn junction forming method using the same, and a pn junction device including the micro heater array and the pn junction with a large area are provided to simplify process equipment by removing a complex heating device in a chamber for forming the pn junction. CONSTITUTION: A micro heater array(101) includes a substrate(10), at least one first micro heater(20), and at least one second micro heater(30). One first micro heater or more are equipped on the substrate in parallel in one direction. The first micro heater includes a first heating unit(21), and a first supporter(22). The first heating unit is separated from the substrate. The first heating unit is extended to one direction. The first supporters are separately equipped on the substrate. The second micro heater includes a second heating unit(31), and second supporters(32). The second heating unit is extended to a direction vertical to the one direction. The supporters are separately equipped on the substrate. The second supporters support the second heating unit.
Abstract translation: 目的：提供一种微加热器阵列，使用该微加热器阵列的pn结形成方法以及包括微加热器阵列和大面积的pn结的pn结装置，以通过去除腔室中的复杂加热装置来简化加工设备 形成pn结。 构造：微加热器阵列（101）包括基底（10），至少一个第一微加热器（20）和至少一个第二微加热器（30）。 一个第一微加热器或更多的器件在一个方向上平行地装在衬底上。 第一微加热器包括第一加热单元（21）和第一支架（22）。 第一加热单元与基板分离。 第一个加热单元延伸到一个方向。 第一个支持者分别装在基板上。 第二微加热器包括第二加热单元（31）和第二支撑件（32）。 第二加热单元延伸到垂直于该一个方向的方向。 支撑者分别装在基板上。 第二支持者支持第二个加热单元。
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公开(公告)号：KR1020090008048A
公开(公告)日：2009-01-21
申请号：KR1020070071341
申请日：2007-07-16
Applicant: 삼성전자주식회사
CPC classification number: H05B3/26 , H01C17/065 , H05B2203/017 , H05B2214/04 , Y10T29/49082
Abstract: A micro heater unit, micro heater array, manufacturing method thereof, and electronic device using the same are provided to reduce power consumption by minimizing dimension of heat transfer region between heating unit and supporter. A micro heater unit(100) comprises a substrate(10), a heating unit(20), and a supporter(30). The heating unit is arranged on the substrate with constant interval. The supporter is positioned between the substrate and the heating unit, and supports the heating unit in a lower part of the heating unit. The heating unit has a first region(21) and a second region(25). A width of the second region is greater than a width of the first region. The supporter supports the heating unit in a lower part of the second region of the heating unit. A dimension of a contact region(35) between the supporter and the second region of the heating unit is smaller than a dimension of the second region.
Abstract translation: 提供微加热器单元，微加热器阵列，其制造方法和使用其的电子设备，以通过最小化加热单元和支撑件之间的传热区域的尺寸来降低功耗。 微加热器单元（100）包括基板（10），加热单元（20）和支撑件（30）。 加热单元以恒定的间隔布置在基板上。 支撑件位于基板和加热单元之间，并且在加热单元的下部支撑加热单元。 加热单元具有第一区域（21）和第二区域（25）。 第二区域的宽度大于第一区域的宽度。 支撑件在加热单元的第二区域的下部支撑加热单元。 加热单元的支撑件和第二区域之间的接触区域（35）的尺寸小于第二区域的尺寸。
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公开(公告)号：KR1020080105338A
公开(公告)日：2008-12-04
申请号：KR1020070052802
申请日：2007-05-30
Applicant: 삼성전자주식회사
IPC: H01L21/283 , H01L29/78 , B82Y40/00
CPC classification number: H01L51/0012 , B82Y10/00 , H01L51/001 , H01L51/0048 , H01L51/0508 , H01L51/102 , H01L2221/1094 , Y10S977/742 , H01L21/2807
Abstract: An electrode, an electric component, a field effect transistor, a manufacturing method thereof and the carbon nanotube growth process are provided to form the thin catalyst at the desired location of the electrode near side. An electrode(10) comprises the transparent electrode layer(12), the opaque electrode layer(14), and the catalyst(16). The opaque electrode layer exists on the transparent electrode layer. The catalyst exists on the open side(15) on the transparent electrode layer which is not covered by the opaque electrode layer. The carbon nanotube is grown horizontally from the catalyst.
Abstract translation: 提供电极，电子部件，场效应晶体管，其制造方法和碳纳米管生长工艺，以在靠近电极的所需位置形成薄催化剂。 电极（10）包括透明电极层（12），不透明电极层（14）和催化剂（16）。 不透明电极层存在于透明电极层上。 催化剂存在于未被不透明电极层覆盖的透明电极层的开放侧（15）上。 碳纳米管从催化剂水平生长。
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公开(公告)号：KR1020080070204A
公开(公告)日：2008-07-30
申请号：KR1020070007913
申请日：2007-01-25
Applicant: 삼성전자주식회사
IPC: G02F1/15
CPC classification number: B41M5/26 , B41M5/36 , G02F1/134336 , G09F3/02
Abstract: A display device is provided to reduce the thickness and simplification of structure and have a foldable or bendable characteristic by using a thermochromic material. A micro heater array(110) includes a plurality of micro heaters(111) arranged on a plane. An electrode array(105) are formed in a matrix type. The electrode array applies driving voltages to the micro heaters included in the micro heater array individually. A thermochromic material(115) is disposed on each of the micro heaters. A color of the thermochromic material in a temperature lower than a discoloration temperature is different from a color of the thermo material in a temperature higher than the discoloration temperature.
Abstract translation: 提供了一种显示装置，以减小结构的厚度和简化，并且通过使用热变色材料具有可折叠或弯曲的特性。 微加热器阵列（110）包括布置在平面上的多个微加热器（111）。 电极阵列（105）形成为矩阵型。 电极阵列分别向微加热器阵列中包括的微加热器施加驱动电压。 热致变色材料（115）设置在每个微加热器上。 在低于变色温度的温度下，热变色材料的颜色在高于变色温度的温度下与热材料的颜色不同。
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