公开(公告)号：KR1020090019448A

公开(公告)日：2009-02-25

申请号：KR1020070083890

申请日：2007-08-21

Applicant: 삼성전자주식회사

Inventor： 이상근 ,  최민호 ,  이기호 ,  한동경 ,  신현용

IPC: H01L21/02

Abstract: A semiconductor fabrication equipment is provided to minimize scratch generation at the semiconductor substrate due to the contact between a semiconductor substrate and a lift pin by making lift pin of the material less than the Mohs hardness 7.0. A equipment for semiconductor fabrication includes a processing chamber, a substrate stage and a lift stage(80). The substrate stage comprises a substrate chuck and a chuck support stand having a derivative hole. The lift stage comprises a lift chuck(60), a lift pin(50) and a lift support stand(70). The lift pin passes the derivative hole of the substrate chuck from the upper part of the lift chuck. The lift pin comprises the material less than the Mohs hardness 7.0.

Abstract translation: 提供半导体制造设备，以通过使材料的提升销小于莫氏硬度7.0，由于半导体衬底和升降销之间的接触，最小化在半导体衬底处的划痕产生。 一种用于半导体制造的设备包括处理室，衬底台和升降台（80）。 衬底台包括衬底卡盘和具有衍生孔的卡盘支撑架。 提升台包括提升卡盘（60），升降销（50）和升降支撑架（70）。 提升销从提升卡盘的上部穿过基板卡盘的导孔。 提升销包括小于莫氏硬度7.0的材料。

公开(公告)号：KR100764057B1

公开(公告)日：2007-10-08

申请号：KR1020060089332

申请日：2006-09-14

Applicant: 삼성전자주식회사

Inventor： 한동경

IPC: H01L21/027

CPC classification number: G03F7/701 ,  G02B5/005 ,  G03B27/72 ,  G03F7/70125 ,  G03F7/70308 ,  G03F7/7055

Abstract: An aperture unit, an exposure system having the same, and a method for replacing an aperture in the same are provided to shorten a replacing time of an aperture by easily replacing an aperture of wanted shape on an optical path. Apertures(10) are loaded in a cassette(380), and the apertures are located on an optical path to vary incident light in various shapes. Revolvers(320,340) are provided with plural slots for receiving the apertures to selectively position the apertures on the optical path by the rotation of the revolver. A transfer unit(360) transfers the aperture from the cassette to instal the aperture in the slot. The slots are formed on an outer periphery of the revolver.

Abstract translation: 提供孔单元，具有该孔单元的曝光系统和用于更换其中的孔的方法，以通过容易地替换光路上所需形状的孔来缩短孔的替换时间。 孔（10）被装载在盒（380）中，并且孔位于光路上以改变各种形状的入射光。 旋转轮（320,340）设置有多个槽，用于接收孔，以通过旋转枪的旋转选择性地将光圈定位在光路上。 传送单元（360）从光盘传送光圈以插入插槽中的光圈。 狭槽形成在左轮手枪的外周上。

公开(公告)号：KR1020060015376A

公开(公告)日：2006-02-17

申请号：KR1020040064101

申请日：2004-08-14

Applicant: 삼성전자주식회사

Inventor： 한동경

IPC: H01L21/02 ,  H01L21/027

CPC classification number: G03F7/70925 ,  H01L21/02057

Abstract: 척 상면의 이물질을 제거하여 반도체 노광 공정 시 웨이퍼 표면에 초점 불일치 현상이 발생하지 않도록 하기 위한 반도체 제조용 이물질 제거 장치 및 제거 방법을 제공한다. 반도체 제조용 이물질 제거 장치는 웨이퍼를 안착시키는 척 상면에 밀착되어 사용되며, 진공압을 이용해 상기 척 상면의 이물질을 일시에 흡착해 제거하는 흡착부, 흡착부에 진공압을 작용하고 제어하는 진공압 제어부 및 흡착부와 진공압 제어부를 연결하며 진공압의 통로로 이용되는 진공관부를 포함한다.
반도체, 노광 장치, 초점 불일치 현상, 이물질 제거, 흡착, 진공압

公开(公告)号：KR1020030000093A

公开(公告)日：2003-01-06

申请号：KR1020010035730

申请日：2001-06-22

Applicant: 삼성전자주식회사

Inventor： 한동경 ,  박병철

IPC: H01L21/027

Abstract: PURPOSE: A system for controlling exposure equipment is provided to stop the exposure equipment as soon as an exposure defect occurs, by immediately stopping the exposure equipment if line width data and align stage data fall outside a parameter limit. CONSTITUTION: The exposure equipment(10) includes an exposure unit in which an exposure process is performed on a wafer. A line width measuring apparatus(20) measures the line width of the pattern formed on the wafer. An align state measuring apparatus(30) measures the align state of the pattern formed on the wafer. A scattering control unit(40) makes the measured line width data and the measured align state data fedback to each exposure equipment in which an exposure process is performed on the wafer. An input unit receives and stores the fedback line width data and align state data. The parameter limit for determining whether the exposure process is good is inputted into the input unit. A discriminating unit compares the parameter limit with the line width data and align state data inputted into the input unit and stops the exposure equipment if the comparison result falls outside the parameter limit. The exposure equipment further includes the input unit and the discriminating unit.

Abstract translation: 目的：提供一种用于控制曝光设备的系统，一旦出现曝光缺陷就立即停止曝光设备，如果线宽数据和对准平台数据超出参数极限，立即停止曝光设备。 构成：曝光设备（10）包括在晶片上进行曝光处理的曝光单元。 线宽测量装置（20）测量在晶片上形成的图案的线宽。 对准状态测量装置（30）测量在晶片上形成的图案的对准状态。 散射控制单元（40）使得测量的线宽数据和所测量的对准状态数据反馈到在晶片上执行曝光处理的每个曝光设备。 输入单元接收并存储反馈行宽数据并对齐状态数据。 用于确定曝光处理良好的参数限制被输入到输入单元。 鉴别单元将参数限制与行宽数据进行比较，并将输入到输入单元的状态数据对齐，如果比较结果超出参数限制，则停止曝光设备。 曝光设备还包括输入单元和鉴别单元。