公开(公告)号：KR1020110062243A

公开(公告)日：2011-06-10

申请号：KR1020090118905

申请日：2009-12-03

Applicant: 삼성전자주식회사

Inventor： 지용근 ,  김현정 ,  한일균

IPC: H05B37/02 ,  H05B41/24

CPC classification number: H05B33/0806 ,  F21K9/27

Abstract: PURPOSE: An LED illumination apparatus using a ballast for a fluorescent lamp is provided to apply a ballast for a fluorescent lamp to an LED lamp, thereby obtaining the driving stability of the LED lamp. CONSTITUTION: A ballast(10) for a fluorescent lamp includes first to fourth output terminals. Both ends of a first inductor(L1) are connected between the first and second output terminals. Both ends of a second inductor(L2) are connected between the third and fourth output terminals. Two input terminals of a rectification circuit(20) are connected to one end of the first inductor and one end of the second inductor. Both ends of an LED module are connected between the two output terminals of the rectification circuit.

Abstract translation: 目的：提供一种使用荧光灯镇流器的LED照明装置，将荧光灯的镇流器应用于LED灯，从而获得LED灯的驱动稳定性。 构成：用于荧光灯的镇流器（10）包括第一至第四输出端子。 第一电感器（L1）的两端连接在第一和第二输出端子之间。 第二电感器（L2）的两端连接在第三和第四输出端子之间。 整流电路（20）的两个输入端子连接到第一电感器的一端和第二电感器的一端。 LED模块的两端连接在整流电路的两个输出端子之间。

公开(公告)号：KR1020100012170A

公开(公告)日：2010-02-08

申请号：KR1020080073418

申请日：2008-07-28

Applicant: 삼성전자주식회사

Inventor： 한주헌 ,  김병만 ,  류지홍 ,  백창훈 ,  박두성 ,  이철호 ,  박제명 ,  한일균

IPC: F21S2/00

Abstract: PURPOSE: An LED(Light Emitting Diode) lamp is provide to secure stable current supply regardless of surrounding environment by including a constant current IC circuit. CONSTITUTION: An LED lamp includes a plurality of LED package modules(110) and a plate(120). An LED chip(115) is mounted on an LED package module. A filler(117) is coated on the LED package module to protect an LED chip. The filler includes a yellow fluorescent substrate. The LED package modules are mounted on the plate with a constant interval. The plate includes a configuration circuit for connecting the LED package modules.

Abstract translation: 目的：通过包括恒流IC电路，LED（发光二极管）灯可以保证稳定的电流供应，无论周围环境如何。 构成：LED灯包括多个LED封装模块（110）和板（120）。 LED芯片（115）安装在LED封装模块上。 填充物（117）涂覆在LED封装模块上以保护LED芯片。 填料包括黄色荧光底物。 LED封装模块以​​恒定的间隔安装在板上。 该板包括用于连接LED封装模块的配置电路。