公开(公告)号：KR101168315B1

公开(公告)日：2012-07-25

申请号：KR1020090080146

申请日：2009-08-28

Applicant: 삼성전자주식회사

Inventor： 홍승민 ,  이상훈 ,  김용구 ,  윤상복

IPC: G01J3/00 ,  H01L33/48 ,  H01L21/66

CPC classification number: H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: PURPOSE: A manufacturing method of light emitting diode is provided to increase productivity by detecting and inspecting the optical property of the light emitted from LED element before the LED element is detached from a package array. CONSTITUTION: A manufacturing method of light emitting diode comprises follows. A plurality of packages is arranged. LED chips are attached to each package of the package array having the structure where anode and cathode of each packages are electrically isolated(S100). Silicon including fluorescent material is dispensed to each package, which an attachment process is completed(S200~S400). Voltage is applied to each LED chip of the package array in which dispensing is completed in order to inspect the optical property of each LED chip emitting light(S500). LED elements are divided from the package array(S600~S700).

Abstract translation: 目的：提供一种发光二极管的制造方法，通过在LED元件从封装阵列分离之前检测和检查从LED元件发射的光的光学性质来提高生产率。 构成：发光二极管的制造方法如下。 多个包装被布置。 LED芯片被附接到封装阵列的每个封装，具有其中每个封装的阳极和阴极被电隔离的结构（S100）。 包括荧光材料的硅被分配到每个封装，这完成了附接过程（S200〜S400）。 对完成分配的封装阵列的每个LED芯片施加电压，以检查每个发光LED芯片的光学特性（S500）。 LED元件从封装阵列（S600〜S700）中分出。

公开(公告)号：KR1020110025243A

公开(公告)日：2011-03-10

申请号：KR1020090080146

申请日：2009-08-28

Applicant: 삼성전자주식회사

Inventor： 홍승민 ,  이상훈 ,  김용구 ,  윤상복

IPC: G01J3/00 ,  H01L33/48 ,  H01L21/66

CPC classification number: H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: PURPOSE: A manufacturing method of light emitting diode is provided to increase productivity by detecting and inspecting the optical property of the light emitted from LED element before the LED element is detached from a package array. CONSTITUTION: A manufacturing method of light emitting diode comprises follows. A plurality of packages is arranged. LED chips are attached to each package of the package array having the structure where anode and cathode of each packages are electrically isolated(S100). Silicon including fluorescent material is dispensed to each package, which an attachment process is completed(S200~S400). Voltage is applied to each LED chip of the package array in which dispensing is completed in order to inspect the optical property of each LED chip emitting light(S500). LED elements are divided from the package array(S600~S700).

Abstract translation: 目的：提供一种发光二极管的制造方法，通过检测和检查在LED元件从封装阵列分离之前从LED元件发射的光的光学特性来提高生产率。 构成：以下是发光二极管的制造方法。 配置多个包装。 LED芯片附接到具有每个封装的阳极和阴极被电隔离的结构的封装阵列的每个封装（S100）。 包含荧光材料的硅被分配到每个包装，这是完成附着过程（S200〜S400）。 为了检查每个LED芯片发光的光学特性，电压被施加到完成分配的封装阵列的每个LED芯片上（S500）。 LED元件与封装阵列（S600〜S700）分开。