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    홀을 가지는 다공성 박막 및 그의 제조 방법
    2.
    发明公开
    홀을 가지는 다공성 박막 및 그의 제조 방법 有权
    具有孔的多孔薄膜及其制造方法

    公开(公告)号：KR1020120017917A

    公开(公告)日：2012-02-29

    申请号：KR1020100080868

    申请日：2010-08-20

    Applicant: 서강대학교산학협력단

    Inventor： 윤경병 ,  김현성 ,  홍면표 ,  하나비

    IPC: B82B3/00 ,  B01D67/00 ,  B29C67/20 ,  B01D71/04

    CPC classification number: B29D7/01 ,  B01D67/0004 ,  B01D67/0032 ,  B01D67/0041 ,  B01D67/006 ,  B01D69/10 ,  B01D69/12 ,  B01D2325/08 ,  B29C67/20 ,  B29C67/202 ,  Y10T428/24273 ,  Y10T428/24322

    Abstract: PURPOSE: A porous thin film with holes and a method for manufacturing the same are provided to rapidly implement manufacturing processes by using the array layer of particles as a template. CONSTITUTION: A method for manufacturing a porous thin film(180) with holes includes the following: an array layer(150) of particles is formed on a first substrate; the first substrate is in contact with a second substrate(200) to transfer the array layer to the second substrate; the transferred array layer is coated with a first thin film forming material(160) to form a particle-first thin film composite(170); a part of the first thin film is eliminated from the particle-first thin film composite to form a plurality of holes; and particles are eliminated through the holes.

    Abstract translation: 目的：提供具有孔的多孔薄膜及其制造方法，通过使用粒子排列层作为模板来快速实施制造工序。 构成：制造具有孔的多孔薄膜（180）的方法包括：在第一基板上形成粒子的阵列层（150） 第一衬底与第二衬底（200）接触以将阵列层转移到第二衬底; 转印的阵列层被涂覆有第一薄膜形成材料（160）以形成颗粒 - 第一薄膜复合材料（170）; 第一薄膜的一部分从颗粒 - 第一薄膜复合材料中除去以形成多个孔; 并且通过孔消除颗粒。

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