公开(公告)号：KR1020120131797A

公开(公告)日：2012-12-05

申请号：KR1020110050210

申请日：2011-05-26

Applicant: 서울대학교산학협력단

Inventor： 김지홍 ,  전상우 ,  김현희

IPC: G06F19/00

CPC classification number: G06F17/50 ,  G06F1/206

Abstract: PURPOSE: A dynamic calculation of a processor power/thermal model is provided to properly manage heat generation of a processor and to recognize necessary constants for the generation of a thermal model. CONSTITUTION: A processor views a temperature of a processor until a stable temperature state reaches. Necessary information for model calculation is collected. A model is calculated by regression analysis. A power consumption and heat estimating model is calculated in operation of a system based on the collected information. The temperature of the processor is measured through a temperature sensor. [Reference numerals] (AA) Process temperature observation; (BB,FF) No; (CC) Stable state?; (DD,HH) Yes; (EE) Process state information collection; (GG) Enough information collection ?; (II) Model calculation; (JJ) Calculated model

Abstract translation: 目的：提供处理器功率/热模型的动态计算，以正确地管理处理器的发热并识别生成热模型的必要常数。 构成：一个处理器可以看到处理器的温度，直到达到稳定的温度状态。 收集模型计算所需的信息。 模型通过回归分析计算。 在基于收集的信息的系统的操作中计算功耗和热估计模型。 处理器的温度通过温度传感器测量。 （附图标记）（AA）工艺温度观察; （BB，FF）否; （CC）稳定状态 （DD，HH）是; （EE）过程状态信息收集; （GG）足够的信息收集？ （二）模型计算; （JJ）计算模型