-
公开(公告)号：KR1020070100311A
公开(公告)日：2007-10-10
申请号：KR1020077016732
申请日：2006-01-23
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327 , G01N35/02
CPC classification number: B82Y5/00 , G01N33/4875 , Y10T29/49002
Abstract: In a concatenated body of sensor chips, adjacent sensor chips are concatenated in such a way that they can be separated. Each of the sensor chips can effectively be cut off and separated from the concatenated body and after the separation, the sensor chip can easily and rapidly be contained in a container. Furthermore, it is possible to easily inspect the sensor chips and exclude a defective chip. Each of the sensor chips includes a substrate, a cover layer, a hallow reaction unit arranged between the substrate and the cover layer, detection means arranged in the hollow reaction unit, an output terminal for outputting a signal detected by the detection means, and a sample introduction opening for introducing a sample into the hollow reaction unit. The manufacturing method of the concatenated body of sensor chips is also disclosed.
Abstract translation: 在传感器芯片的连接体中，相邻的传感器芯片以可分离的方式连接。 每个传感器芯片可以有效地被切断并与分离的主体分离，并且在分离之后，传感器芯片可以容易且快速地容纳在容器中。 此外，可以容易地检查传感器芯片并排除有缺陷的芯片。 每个传感器芯片包括衬底，覆盖层，布置在衬底和覆盖层之间的中心反应单元，布置在中空反应单元中的检测装置，用于输出由检测装置检测到的信号的输出端子，以及 用于将样品引入中空反应单元的样品引入开口。 还公开了传感器芯片级联体的制造方法。
-
公开(公告)号：KR1020080067571A
公开(公告)日：2008-07-21
申请号：KR1020077023688
申请日：2006-10-16
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327 , G01N27/26
CPC classification number: C12Q1/002
Abstract: A biosensor chip that is fitted with a reaction chamber of small volume capable of measuring with traces of measuring sample and has a potassium ferricyanide of minute crystal grain diameter disposed in the reaction chamber so as to attain rapid and accurate measuring; and a process for producing the same. Biosensor chip (1) has electrodes (3,4) disposed on top of lower substrate (2) and further has lower spacer (5(7,8)) bonded thereto. Upper spacer (11(12,13)) is bonded to upper substrate (15), and the upper and lower spacers (5,11) are bonded together with adhesive (10). Lower groove part (9) is provided between long and short lower spacers (7,8). Upper groove part (14) is provided between long and short upper spacers (12,13). The upper and lower groove parts (14,9) define reaction chamber (17). The volume of the reaction chamber (17) is 0.3 VL, and enzyme (18) and potassium ferricyanide are disposed in facing relationship with a spacing therebetween. The crystal grain diameter of potassium ferricyanide is not greater than 100 mum, and the amount thereof is Vx0.1 mg wherein V is the volume of the reaction chamber (17).
Abstract translation: 一种生物传感器芯片，其装配有能够用微量测量样品测量的体积小的反应室，并具有设置在反应室中的具有微小晶粒直径的铁氰化钾，以获得快速和准确的测量; 及其制造方法。 生物传感器芯片（1）具有设置在下基板（2）的上方的电极（3,4），并且还具有与其键合的下间隔物（5（7,8））。 上垫片（11（12,13））粘合到上基板（15）上，上间隔件（5,11）与粘合剂（10）粘结在一起。 下槽部分（9）设置在长和短的下间隔件（7,8）之间。 上槽部分（14）设置在长和短的上间隔件（12,13）之间。 上部和下部槽部分（14,9）限定反应室（17）。 反应室（17）的体积为0.3VL，酶（18）和铁氰化钾以与它们之间的间隔的面对关系设置。 铁氰化钾的晶粒直径不大于100μm，其量为Vx0.1mg，其中V为反应室（17）的体积。
-
公开(公告)号：KR1020070100326A
公开(公告)日：2007-10-10
申请号：KR1020077017017
申请日：2006-01-23
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327
CPC classification number: G01N27/3272
Abstract: A sensor chip includes a substrate, a cover layer, a hollow reaction unit arranged between the substrate and the cover layer for performing reaction between a sample and a medicament applied into it, detection means formed by an electrode exposed to the hollow reaction unit, and a sample introduction opening for introducing a sample into the hollow reaction unit. A portion of the substrate of the cover layer opposing to the detection means in the hollow reaction unit is entirely transparent. Alternatively, a sensor chip includes a plate (A) having a groove (A) into which a medicament is applied and a plate (B) having a groove (B). The groove (A) is coupled to the groove (B) and layered so as to obtain the hollow reaction unit. The groove (B) has an opening width greater than an opening of the groove (A) at a portion opposing to at least a portion of the groove (A) where the medicament is applied.
Abstract translation: 传感器芯片包括衬底，覆盖层，布置在衬底和覆盖层之间的中空反应单元，用于进行样品与施加于其中的药物之间的反应，由暴露于中空反应单元的电极形成的检测装置，以及 用于将样品引入中空反应单元的样品引入开口。 与中空反应单元中的检测装置相对的覆盖层的基板的一部分是完全透明的。 或者，传感器芯片包括具有其中施加药物的凹槽（A）的板（A）和具有凹槽（B）的板（B））。 槽（A）与槽（B）连接并分层，以获得中空反应单元。 所述凹槽（B）的开口宽度大于所述凹槽（A）的与所施加药物的凹槽（A）的至少一部分相对的部分的开口。
-
公开(公告)号：KR100112442B1
公开(公告)日：1997-02-25
申请号：KR1019920006528
申请日：1992-04-18
Applicant: 스미토모덴키고교가부시키가이샤
IPC: G02B6/00
-
公开(公告)号：KR1020080069904A
公开(公告)日：2008-07-29
申请号：KR1020077020851
申请日：2006-10-25
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327 , G01N27/26 , G01N27/416
CPC classification number: C12Q1/001 , G01N27/3272 , G01N33/5438
Abstract: Provided are a sensor chip which permits deterioration status of an agent applied on a reacting section of the sensor chip to be detected at the time of measuring concentration of a material to be measured, and a sensor system which can perform accurate measurement while detecting the deterioration status of the agent by using such sensor chip. In the sensor chip, two substrates facing each other and a spacer layer between the substrates are provided, a plurality of reacting sections are provided in the spacer layer, and on the surface of the substrate on the spacer layer side, an electrode system for detection is arranged to expose in the reacting section. The sensor chip is characterized in that the same agent (A) is applied on two or more reacting sections among the reacting sections, and furthermore, on at least one reacting section of the two or more reacting sections, another agent (B) which reacts with the agent (A) is applied. The sensor system is characterized in that the system is provided with a measuring means which compares current values from the sensor chip and each of the two or more reacting sections.
Abstract translation: 提供一种传感器芯片，其允许在测量待测材料的浓度时检测传感器芯片的反应部分上的试剂的劣化状态，以及可以在检测到劣化的同时进行精确测量的传感器系统 使用这种传感器芯片的代理状态。 在传感器芯片中，设置彼此面对的两个基板和基板之间的间隔层，在间隔层中设置多个反应部，在间隔层侧的基板的表面上设置检测用电极系 被布置成暴露在反应部分中。 传感器芯片的特征在于，在反应部分中的两个以上的反应部分上施加相同的试剂（A），此外，在两个或更多个反应部分的至少一个反应部分上，另外的反应部分（B） 使用代理（A）。 传感器系统的特征在于，该系统设置有测量装置，其将来自传感器芯片的电流值与两个或更多个反应部分中的每一个进行比较。
-
Patent Agency Ranking
公开(公告)号：KR1019970000134B1
公开(公告)日：1997-01-04
申请号：KR1019920008419
申请日：1992-05-19
Applicant: 스미토모덴키고교가부시키가이샤
IPC: B65H63/036
CPC classification number: B65H57/003 , B65H54/88 , B65H63/036 , B65H63/06 , B65H65/00 , B65H2701/32 , G01M11/088 , G02B6/4457
Abstract: 내용 없음.
-
公开(公告)号：KR1019920022012A
公开(公告)日：1992-12-19
申请号：KR1019920008419
申请日：1992-05-19
Applicant: 스미토모덴키고교가부시키가이샤
IPC: B65H63/036
Abstract: 내용 없음.
-
公开(公告)号：KR1019920020224A
公开(公告)日：1992-11-20
申请号：KR1019920006528
申请日：1992-04-18
Applicant: 스미토모덴키고교가부시키가이샤
IPC: G02B6/00
Abstract: 내용 없음
-
公开(公告)号：KR1020070100318A
公开(公告)日：2007-10-10
申请号：KR1020077016870
申请日：2006-01-23
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327 , G01N27/28
CPC classification number: G01N27/3272
Abstract: There is provided a sensor chip manufacturing method for manufacturing a sensor chip including a substrate, a cover layer, a spacer layer arranged between the substrate and the cover layer, and a hollow reaction unit arranged in the spacer layer. The method includes a step for attaching two or more adhesive tapes to a sheet forming a plurality of substrates or to a plurality of substrates so as to form a spacer layer and forming a hollow reaction unit by a gap defined by one or more of the tapes. It is possible to reduce the volume irregularities and positional shifts of the hollow reaction units. A sensor chip manufactured by this method is also disclosed.
Abstract translation: 提供了一种用于制造传感器芯片的传感器芯片制造方法，所述传感器芯片包括衬底，覆盖层，布置在衬底和覆盖层之间的间隔层，以及布置在间隔层中的中空反应单元。 该方法包括将两个或更多个胶带粘附到形成多个基底的片材或多个基底上以形成间隔层并通过由一个或多个带子限定的间隙形成中空反应单元的步骤 。 可以减小中空反应单元的体积不规则和位置偏移。 还公开了通过该方法制造的传感器芯片。
-
公开(公告)号：KR1020070027603A
公开(公告)日：2007-03-09
申请号：KR1020067026904
申请日：2005-06-21
Applicant: 스미토모덴키고교가부시키가이샤 , 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼
IPC: G01N27/327 , G01N27/416
CPC classification number: G01N27/26
Abstract: A sensor chip is provided with a board, a cover layer, a spacer layer sandwiched between the board and the cover layer, and a hollow reacting part between the board and the cover layer. The sensor chip does not warp due to changes of temperature and humidity in the environment. A method for manufacturing such sensor chip is also provided. The sensor chip is provided with the board, the cover layer, the spacer layer sandwiched between the board and the cover layer, the hollow reacting part between the board and the cover layer, and a detecting means in the hollow reacting part. The board and the cover layer are made of the same material and have the same thickness. The material and the shape of the spacer layer are symmetric to a flat plane which is parallel to the board at equal distances from the board and the cover layer. ® KIPO & WIPO 2007
Abstract translation: 传感器芯片设置有板，覆盖层，夹在板和覆盖层之间的间隔层，以及在板和覆盖层之间的中空反应部。 传感器芯片由于环境温度和湿度的变化而不会翘曲。 还提供了一种用于制造这种传感器芯片的方法。 传感器芯片设置有板，覆盖层，夹在板和覆盖层之间的间隔层，板和覆盖层之间的中空反应部分以及中空反应部分中的检测装置。 板和覆盖层由相同的材料制成并且具有相同的厚度。 间隔层的材料和形状与平板平面对称，该平面与板和覆盖层等距离地平行。 ®KIPO＆WIPO 2007
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.02 seconds)
