公开(公告)号：KR1020070084174A

公开(公告)日：2007-08-24

申请号：KR1020077010682

申请日：2005-10-17

Applicant: 에프씨아이

Inventor： 미니츠스티븐

IPC: H01R12/12 ,  H01R29/00

CPC classification number: H05K1/144 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/044 ,  H05K2201/096 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: A mid-plane is disclosed. The mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector and having a plurality of unplated clearance holes adapted to receive tails attached to a second connector. The second printed circuit board has a plurality of plated vias adapted to receive tails attached to the second connector and has a plurality of unplated clearance adapted to receive tails attached to the first connector.

Abstract translation: 披露了一架中型飞机。 中间平面包括具有多个电镀通孔的第一印刷电路板，该电镀通孔适于接收连接到第一连接器的尾部，并且具有适于接收连接到第二连接器的尾部的多个未放置的间隙孔。 第二印刷电路板具有适于接收连接到第二连接器的尾部的多个电镀通孔，并且具有适于接收连接到第一连接器的尾部的多个未平坦的间隙。