公开(公告)号：KR1020040008218A

公开(公告)日：2004-01-28

申请号：KR1020037016191

申请日：2002-06-19

Applicant: 웨이브콤

Inventor： 드비비코프알렉시스

IPC: H05K13/04

CPC classification number: H05K3/3415 ,  H05K1/141 ,  H05K3/303 ,  H05K13/0491 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10393 ,  Y02P70/613

Abstract: The invention relates to a method for assembly and/or disassembly of at least one electronic module (1) on an application card (2), said module comprising at least two component elements, that is, at least one printed circuit (12) and at least one other component element (11, 13) mechanically connected by at least one solder joint (14, 15) to said printed circuit (12), said module further comprising a set of extension elements (16) by soldering of said module (1) to an application card (2). According to the invention, said method provides a spring-effect (3) mechanical connection of said component elements (11, 12, 13) to said at least one module (1) such as to guarantee the mechanical connection after the soldering of said set of extension elements for the assembly and/or assembly of said module (1) on said application card (2).