公开(公告)号：KR1020110015193A

公开(公告)日：2011-02-15

申请号：KR1020090072787

申请日：2009-08-07

Applicant: 전남대학교산학협력단

Inventor： 이무성 ,  김성헌 ,  김석민 ,  박은주

IPC: C08J7/12 ,  C08J7/06 ,  H05K3/00 ,  H01M4/38

Abstract: PURPOSE: A method for modifying the surface of polymer-based substrate for the deposition of a gold thin film is provided to improve interface adhesion between a gold thin film formed on the surface of the polymer-based substrate and a substrate. CONSTITUTION: A method for modifying the surface of polymer-based substrate for the deposition of a gold thin film comprises the steps of: introducing a -COOH functional group to the surface of a polymer-based substrate for depositing the gold thin film; activating the introduced -COOH functional group; and introducing an -SH functional group to the surface of the polymer-based substrate using the activated -COOH functional group.

Abstract translation: 目的：提供一种用于改性聚合物基底表面以沉积金薄膜的方法，以改善在基于聚合物的基底表面上形成的金薄膜与基底之间的界面粘合性。 构成：用于改性用于沉积金薄膜的聚合物基底表面的方法包括以下步骤：在基于聚合物的基底的表面上引入-COOH官能团以沉积金薄膜; 活化引入的-COOH官能团; 并使用活化的-COOH官能团将-SH官能团引入到基于聚合物的基材的表面。