은 나노입자를 함유한 저온소성 페이스트 조성물 및 이를이용한 도전성 후막의 제조방법
    1.
    发明公开
    은 나노입자를 함유한 저온소성 페이스트 조성물 및 이를이용한 도전성 후막의 제조방법 无效
    导电胶组合物和使用其制备导体厚膜的方法

    公开(公告)号:KR1020080096204A

    公开(公告)日:2008-10-30

    申请号:KR1020070041361

    申请日:2007-04-27

    Abstract: A low temperature cofired paste composition containing nanosilver particles and a manufacturing method of the conductive thick film using the same are provided to manufacture the low temperature cofired paste using silver particles of nano size, to reduce the waste of material and to solve the disadvantage that the precision of the electrode morphology is decreased. A low temperature cofired paste composition containing nanosilver particles comprises silver powder of nano-size, glass powder, and vehicle as a solvent in a mass rate of 80:1:19. A manufacturing method of the conductive thick film using the low temperature cofired paste composition comprises a step for screen-printing the paste composition on an alumina substrate with the screen mask; a step for drying the paste composition at 120deg.C for 20 minutes to remove the vehicle so as to form a thick film; and a step for heat-treating the thick film at 250~450deg.C for 15 minutes.

    Abstract translation: 提供含有纳米银粒子的低温共烧糊剂组合物和使用其的导电性厚膜的制造方法,以制造使用纳米尺寸的银粒子的低温共烧糊剂,以减少材料的浪费,并解决以下缺点: 电极形态的精度降低。 含有纳米银粒子的低温共烧糊剂组合物包含纳米尺寸的银粉,玻璃粉末和作为溶剂的载体,质量比为80:1:19。 使用低温共烧糊组合物的导电性厚膜的制造方法包括用丝网掩模将糊料组合物丝网印刷在氧化铝基板上的工序; 在120℃下干燥糊剂组合物20分钟以除去载体以形成厚膜的步骤; 以及在250〜450℃下对厚膜进行15分钟的热处理的工序。

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