도전부재용 감압식 접착제 조성물, 및 이를 이용하여 제조된 적층체
    2.
    发明公开
    도전부재용 감압식 접착제 조성물, 및 이를 이용하여 제조된 적층체 有权
    用于导电组件和层压板的压敏胶粘组合物

    公开(公告)号:KR1020110009641A

    公开(公告)日:2011-01-28

    申请号:KR1020100070938

    申请日:2010-07-22

    CPC classification number: C09J175/02 C09J11/02 C09J175/04 G06F3/041

    Abstract: PURPOSE: A pressure-sensitive adhesive composition is provided to prevent malfunction caused by corrosion in a conductive member such as a conductive layer or metallic circuit including ITO and to ensure excellent plasticizer resistance, heat resistance and humidity resistance. CONSTITUTION: A pressure-sensitive adhesive composition for conductive members comprises 100.0 parts by weight of urethane urea resin with 50,000~200,000 of average molecular weight, and 0.1~3 parts by weight of hardener. The urethaneurea resin is obtained by reacting a urethane prepolymer with a polyamino compound, wherein the urethane prepolymer is obtained by reacting polyol with polyisocyanate.

    Abstract translation: 目的:提供压敏粘合剂组合物,以防止诸如导电层或包括ITO的金属电路在内的导电构件中由腐蚀引起的故障,并且确保优异的耐增塑剂性,耐热性和耐湿性。 构成:用于导电构件的压敏粘合剂组合物包含100.0重量份具有50,000〜200,000平均分子量的氨基甲酸酯脲树脂和0.1〜3重量份硬化剂。 氨基脲脲树脂通过氨基甲酸酯预聚物与聚氨基化合物反应得到,其中氨基甲酸酯预聚物是通过使多元醇与多异氰酸酯反应获得的。

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