公开(公告)号：KR100327156B1

公开(公告)日：2002-03-29

申请号：KR1019990037548

申请日：1999-09-04

Applicant: 한국과학기술연구원

Inventor： 황승상 ,  홍순만 ,  김환규 ,  백남섭 ,  송영배 ,  도영규 ,  유정수

IPC: C08G73/10

Abstract: 본발명은졸-겔과정을통하여합성된유기/무기혼성절연저유전체재료에관한것으로, 열적물리적성질이우수하고화학적으로도매우안정한폴리이미드를함유하고, 그의측쇄에졸-겔공정용트리에톡시실란이공유결합형태로결합된화합물에관한것이다. 특히, 본발명은하기화학식 1의폴리이미드계졸-겔전구체, 하기화학식 2 및 3의아다만틸계폴리이미드화졸-겔전구체, 및폴리이미드/실리카혼성된고분자재료에공소(foam 또는 void)화된졸-겔단량체가도입된하기화학식 4의유기/무기혼성절연저유전체재료에관한것이다. 화학식 1의화합물은졸-겔과정을거치면서가교화가일어나서기계적강도가높고, Y에공소(Void)가도입됨으로써유전상수가낮아진화학식 4의화합물이형성된다. 상기식에서, X는,등을포함하는졸-겔공정용트리에톡시실란함유방향족화합물이다. 상기식에서, Y는등을포함하는공소화된화합물이다.

公开(公告)号：KR1020010026296A

公开(公告)日：2001-04-06

申请号：KR1019990037548

申请日：1999-09-04

Applicant: 한국과학기술연구원

Inventor： 황승상 ,  홍순만 ,  김환규 ,  백남섭 ,  송영배 ,  도영규 ,  유정수

IPC: C08G73/10

Abstract: PURPOSE: Provided are a polyimide sol-gel precursor, a void sol-gel monomer and a void organic-inorganic insulating low-dielectric substance prepared therefrom, which has high mechanic strength and lowered dielectric constant. CONSTITUTION: The polyimide sol-gel precursor having a triethoxysilane for a sol-gel process at a branch of polyimide is represented by the following formula (1). The polyimide sol-gel precursor having a triethoxysilane for a sol-gel process at a branch of adamantyl polyimide is represented by the following chemical formula (2) or (3). In the formulae (1), (2) and (3), X is a triethoxysilane containing an aromatic compound for a sol-gel process. The void sol-gel monomer is selected from compounds described as the formulae (5), (6), (7) and (8) in a description. The void organic-inorganic insulating low-dielectric substance is prepared by easily covalent bond with the void sol-gel monomer and is represented by the following formula (4).

Abstract translation: 目的：提供一种聚酰亚胺溶胶 - 凝胶前体，空穴溶胶 - 凝胶单体和由其制备的空隙有机 - 无机绝缘低介电物质，其机械强度高和介电常数降低。 构成：在聚酰亚胺的分支处具有用于溶胶 - 凝胶法的三乙氧基硅烷的聚酰亚胺溶胶 - 凝胶前体由下式（1）表示。 在金刚烷基聚酰亚胺的支链上具有用于溶胶 - 凝胶法的三乙氧基硅烷的聚酰亚胺溶胶 - 凝胶前体由以下化学式（2）或（3）表示。 在式（1），（2）和（3）中，X是含有用于溶胶 - 凝胶法的芳族化合物的三乙氧基硅烷。 空隙溶胶凝胶单体选自在描述中描述为式（5），（6），（7）和（8）的化合物。 空隙有机 - 无机绝缘性低介电物质通过与空穴溶胶 - 凝胶单体容易共价键合而制备，并由下式（4）表示。