公开(公告)号：KR100752533B1

公开(公告)日：2007-08-29

申请号：KR1020060109108

申请日：2006-11-06

Applicant: 한국과학기술연구원

Inventor： 이상수 ,  김준경 ,  정해은 ,  박민 ,  임순호 ,  이현정

IPC: H01B1/22

Abstract: Provided are a polymer microcapsule-conductive particle composite which can repair the mechanical stability-damaged part such as micropore by the discharging and curing of a curing organic compound in case of the breakage of a polymer microcapsule, and a method for preparing the polymer microcapsule-conductive particle composite. A polymer microcapsule-conductive particle composite comprises a conductive particle which comprises a conductive metal particle or a polymer particle, and a conductive metal layer coated on the surface of the conductive metal particle or the polymer particle; and a polymer microcapsule which comprises a core part comprising a curing material and a shell part and has a surface functional group having the affinity to the metal. Preferably the polymer microcapsule is adsorbed on the surface of the conductive particle, or the conductive particle is adsorbed on the surface of the polymer microcapsule.

Abstract translation: 本发明提供一种聚合物微胶囊 - 导电性粒子复合体及其制造方法，该聚合物微胶囊 - 导电性粒子复合体通过在高分子微胶囊破损时固化有机化合物的排出固化而修复微孔等机械稳定性损伤部分， 导电颗粒复合物。 聚合物微胶囊 - 导电颗粒复合物包含导电颗粒和导电金属层，导电颗粒包含导电金属颗粒或聚合物颗粒，导电金属层涂覆在导电金属颗粒或聚合物颗粒的表面上; 以及包含核部分的聚合物微胶囊，所述核部分包含固化材料和壳部分并且具有对金属具有亲和性的表面官能团。 优选地，聚合物微胶囊被吸附在导电颗粒的表面上，或者导电颗粒被吸附在聚合物微胶囊的表面上。

公开(公告)号：KR100787381B1

公开(公告)日：2007-12-24

申请号：KR1020060113534

申请日：2006-11-16

Applicant: 한국과학기술연구원

Inventor： 이상수 ,  김준경 ,  정해은 ,  임순호 ,  박민 ,  이현정

IPC: C09J9/02 ,  C09J7/02 ,  C09J9/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1163 ,  Y10T428/254 ,  Y10T428/2989 ,  C09J9/02 ,  C09J2201/602

Abstract: A microcapsule-conductive particle composite, its preparation method, and an anisotropic conductive adhesive film using the microcapsule-conductive particle composite are provided to control surface adsorption density, to prevent the agglomeration of particles and to improve low temperature fast curing effect. A microcapsule-conductive particle composite comprises a conductive metal particle or a conductive particle comprising a polymer particle whose surface is coated with a conductive metal layer; and a microcapsule which has a surface functional group with the affinity to the metal, and comprises a core part and a shell part, wherein the microcapsule is adsorbed on the surface of the conductive particle or the conductive particle is adsorbed on the surface of the microcapsule, and the core part of the microcapsule comprises a low temperature fast curing type organic compound curing agent.

Abstract translation: 提供微胶囊导电颗粒复合材料，其制备方法和使用微胶囊导电颗粒复合材料的各向异性导电粘合剂膜以控制表面吸附密度，以防止颗粒附聚并改善低温快速固化效果。 微胶囊导电颗粒复合材料包括导电金属颗粒或包含其表面涂覆有导电金属层的聚合物颗粒的导电颗粒; 和具有对金属具有亲和性的表面官能团的微胶囊，并且包含核心部分和壳部分，其中所述微胶囊被吸附在所述导电粒子的表面上或所述导电粒子被吸附在所述微胶囊的表面上 ，微胶囊的核心部分包含低温快速固化型有机化合物固化剂。