公开(公告)号：KR100397841B1

公开(公告)日：2003-09-13

申请号：KR1020010041076

申请日：2001-07-10

Applicant: 한국과학기술원

Inventor： 이경우 ,  김종호 ,  엄윤용 ,  이순복

IPC: G01N3/00

Abstract: PURPOSE: A device for measuring fracture toughness of specimen is provided to achieve improved sensitivity by reducing interferences among three axes and measuring pure bending force. CONSTITUTION: A device for measuring fracture toughness of specimen, comprises a base(100); a linear step motor(200) mounted on the base so as to generate a driving force; a support(300) mounted on the linear step motor in such a manner that the support reciprocates in a horizontal direction; a vertically movable unit(400) coupled to the side of the support in such a manner that the vertically movable unit is movable in a vertical direction by the adjustment of a vernier caliper(420); a grip unit(500) having a forward grip(520) coupled to the side surface of the vertically movable unit and coupled to an end of a specimen(540) through a connection grip(560); a load cell(600) coupled to the connection grip, and which has a plurality of strain gauges attached to the outer periphery of the load cell so as to measure the force being applied to each direction of x, y and z-axes; and a load cell fixing unit(700) mounted on the base, and which supports an end of the load cell.

Abstract translation: 目的：提供用于测量试样断裂韧性的装置，通过减少三个轴之间的干涉并测量纯弯曲力来提高灵敏度。 一种测量试样断裂韧性的装置，包括基座（100）; 线性步进电机（200），其安装在所述基座上以产生驱动力; 安装在所述线性步进电机上的支撑件（300），使得所述支撑件沿水平方向往复运动; 一个垂直移动单元（400），它以这样一种方式连接在支撑件的侧面上，使得垂直移动单元可以通过调整游标卡尺（420）在垂直方向移动; 具有连接到所述竖直移动单元的所述侧表面并且通过连接把手（560）连接到样本（540）的端部的向前把手（520）的把手单元（500）; 与所述连接把手连接的测力传感器（600），所述测力传感器具有多个应变仪，所述多个应变仪附接到所述测力传感器的外周以测量施加到x，y和z轴的每个方向上的力; 以及安装在基座上并支撑测力传感器的一端的测力传感器固定单元（700）。

公开(公告)号：KR1020030005689A

公开(公告)日：2003-01-23

申请号：KR1020010041076

申请日：2001-07-10

Applicant: 한국과학기술원

Inventor： 이경우 ,  김종호 ,  엄윤용 ,  이순복

IPC: G01N3/00

Abstract: PURPOSE: A device for measuring fracture toughness of specimen is provided to achieve improved sensitivity by reducing interferences among three axes and measuring pure bending force. CONSTITUTION: A device for measuring fracture toughness of specimen, comprises a base(100); a linear step motor(200) mounted on the base so as to generate a driving force; a support(300) mounted on the linear step motor in such a manner that the support reciprocates in a horizontal direction; a vertically movable unit(400) coupled to the side of the support in such a manner that the vertically movable unit is movable in a vertical direction by the adjustment of a vernier caliper(420); a grip unit(500) having a forward grip(520) coupled to the side surface of the vertically movable unit and coupled to an end of a specimen(540) through a connection grip(560); a load cell(600) coupled to the connection grip, and which has a plurality of strain gauges attached to the outer periphery of the load cell so as to measure the force being applied to each direction of x, y and z-axes; and a load cell fixing unit(700) mounted on the base, and which supports an end of the load cell.

Abstract translation: 目的：提供一种用于测量试样断裂韧性的装置，通过减少三轴之间的干扰并测量纯弯曲力来提高灵敏度。 构成：用于测量试样的断裂韧性的装置，包括基体（100）; 安装在所述基座上以产生驱动力的直线步进马达（200）; 支撑件（300），其以支撑件在水平方向上往复运动的方式安装在所述线性步进电机上; 垂直移动单元（400），其以所述可升降单元可通过调节游标卡尺（420）在垂直方向上移动而联接到所述支撑件的侧面; 握持单元（500），其具有联接到所述可垂直移动单元的侧表面的前握柄（520），并且通过连接手柄（560）联接到样本（540）的端部; 耦合到所述连接把手的测力传感器（600），并且具有附接到所述测力传感器的外周的多个应变仪，以测量施加到x，y和z轴的每个方向上的力; 和安装在基座上的称重传感器固定单元（700），并且支撑测力传感器的一端。

公开(公告)号：KR100483956B1

公开(公告)日：2005-04-18

申请号：KR1020020047297

申请日：2002-08-10

Applicant: 한국과학기술원

Inventor： 엄윤용 ,  김재현 ,  최승태 ,  최병익 ,  송준엽 ,  지원호 ,  박재우 ,  정태호

IPC: H01L21/20

Abstract: 본 발명은 화합물 반도체의 가역 웨이퍼 접합기술에서 열응력 최소화 방법에 관한 것으로, 더욱 상세하게는 웨이퍼 접합기술에서 접합 공정시에 사용되는 각 재료의 물성과 온도 공정 조건에 따른 열응력을 평가하는 간단한 관계식을 제시하고, 디바이스 웨이퍼와 폴리머, 캐리어 웨이퍼에 서로 다른 공정 온도를 가하여 웨이퍼 접합을 실행함으로써 접합된 웨이퍼 구조의 굽힘 모멘트가 최소화하며 그 결과 열응력을 최소화하는 웨이퍼 접합방법을 제공하는 것이다. 이를 위해 웨이퍼 접합기술에 있어서, 접합시킬 복수개의 웨이퍼 및 접합재(2)의 치수 및 물성치를 열응력 계산식에 입력하여 복수개의 최적공정온도를 찾아내는 단계; 상기 제1웨이퍼(3)를 상기 최적공정온도로 가열하는 단계; 상기 제2웨이퍼(1)에 상기 접합재(2)를 도포하는 단계; 상기 제2웨이퍼(1)를 상기 제1웨이퍼(3) 위에 정렬하는 단계; 상기 제2웨이퍼(1)를 상기 최적공정온도로 일정시간 가열가압하여 상기 제1웨이퍼(3)에 접합하는 단계로 이루어지는 것을 특징으로 하는 웨이퍼 접합기술에서 열응력 최소화 방법이 제공된다.

公开(公告)号：KR1020040014686A

公开(公告)日：2004-02-18

申请号：KR1020020047297

申请日：2002-08-10

Applicant: 한국과학기술원

Inventor： 엄윤용 ,  김재현 ,  최승태 ,  최병익 ,  송준엽 ,  지원호 ,  박재우 ,  정태호

IPC: H01L21/20

Abstract: PURPOSE: A method for minimizing thermal stress in a reversible wafer bonding technique of a compound semiconductor is provided to prevent the damage of the compound wafer due to the thermal stress generated from a bonding process by detecting an optimum condition. CONSTITUTION: A plurality of optimum process temperature values are obtained by inputting each size and each material property of the first and the second wafer(3,1) and a bonding material(2) into a thermal stress formula. The first wafer(3) is heated under the optimum temperature. The bonding material(2) is coated on the second wafer(1). The second wafer(1) is aligned on the first wafer(3). The second wafer(1) is bonded on the first wafer(3) by heating the second wafer(1) under the optimum temperature during a constant period of time.

Abstract translation: 目的：提供一种用于最小化化合物半导体的可逆晶片接合技术中的热应力的方法，以通过检测最佳条件来防止由于通过接合工艺产生的热应力而导致的复合晶片的损坏。 构成：通过将第一和第二晶片（3,1）的每个尺寸和每种材料特性以及接合材料（2）输入到热应力公式中来获得多个最佳工艺温度值。 第一晶片（3）在最佳温度下被加热。 接合材料（2）涂覆在第二晶片（1）上。 第二晶片（1）在第一晶片（3）上对准。 第二晶片（1）通过在恒定时间段内在最佳温度下加热第二晶片（1）而接合在第一晶片（3）上。