公开(公告)号：KR1020090109001A

公开(公告)日：2009-10-19

申请号：KR1020080034379

申请日：2008-04-14

Applicant: 한국오므론전장주식회사

Inventor： 조현일

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/34 ,  H05K2203/043

Abstract: PURPOSE: An over-register and a PCB and manufacture method are provided to reduce inconvenience of work since exfoliation of the copper land formed in the printed circuit board is not generated even if high temperature compound metal is used in the printed circuit board. CONSTITUTION: In an over-register and a PCB and manufacture method, an over-register covers the surface of a substrate(10) and the surface of a part of a land(11) arranged on the substrate. The over-register prevents the land from being exfoliated from the land or damage to the substrate. The printed circuit board includes a substrate, a land, and a register layer(12), and a land is equipped on the substrate. The register layer covers the surface of the substrate and part surface of the land.

Abstract translation: 目的：为了减少印刷电路板中形成的铜带的剥离，即使在印刷电路板中使用高温复合金属也不会产生剥离，所以提供过量寄存器和PCB及制造方法。 构成：在过注册和PCB和制造方法中，过度对准覆盖衬底（10）的表面和布置在衬底上的焊盘（11）的一部分的表面。 超额登记可防止土地从土地上剥离或损坏基材。 印刷电路板包括衬底，焊盘和寄存器层（12），并且衬底上装有焊盘。 配准层覆盖基板表面和焊盘部分表面。