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公开(公告)号：KR1019930003371B1
公开(公告)日：1993-04-26
申请号：KR1019900021966
申请日：1990-12-27
Applicant: 한국조폐공사
Abstract: interferring with paper-layer in forming on the upper side of chip (6) by conventional paper-making method using paper-making roll (9) in which chip (6) is inserted into depression part (5) opened outwardly and formed on depression-projection part (4) for water-mark forming; forming thin paper-layer (11') on the upper side of chip (6) by pushing paper layer (11) on the wire-mesh near the chip (6) by couching roll (10), contact-attached on paper-marking roll (9); paper-making with the conventional method thereafter.
Abstract translation: 通过使用造纸辊（9）的常规造纸方法在纸芯（6）的上侧形成纸层，其中芯片（6）插入到向外敞开的凹陷部分（5）中，并形成在凹陷 （4）水印成型; 在芯片（6）的靠近芯片（6）的丝网上通过卷边辊（10）推动纸层（11），在芯片（6）的上侧上形成薄纸层（11'）， 卷（9）; 此后采用传统方法进行造纸。
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