公开(公告)号：KR1020140010637A

公开(公告)日：2014-01-27

申请号：KR1020120077148

申请日：2012-07-16

Applicant: 한국항공대학교산학협력단

Inventor： 장석필 ,  이승윤 ,  김현진

IPC: B22F9/24

CPC classification number: B22F9/24 ,  B22F1/0018 ,  B22F2202/01 ,  B22F2303/15 ,  B22F2304/05

Abstract: The present invention relates to a method for manufacturing nanoparticles of tin for solder or tin alloy which is manufactured by a chemical reduction method and has the low melting point by applying ultrasonic energy, and to nanoparticles of tin or tin alloy manufactured by the manufacturing method including: a step of preparing base fluid in a ultrasonic bath (a); a step of putting precursor and surfactant in the base fluid (b); a step of putting a reduction agent (c); a step of applying ultrasonic energy (d); and a step of recovering nanoparticles. According to using a method for manufacturing nanoparticles of tin for solder and tin alloy as above, the present invention can prevent a PCB board from being deformed in the reflow process including a SOP process, a flip chip bonding process, a TSV process, and the like because of the low melting point of the manufactured tin or tin alloy. [Reference numerals] (S10) Preparing base fluid in a ultrasonic bath; (S20) Putting precursor and surfactant in the base fluid; (S30) Putting a reduction agent; (S40) Applying ultrasonic energy; (S50) Manufacturing tin nanoparticles

Abstract translation: 本发明涉及通过化学还原法制造的具有低熔点的超声波能量的焊料或锡合金用锡的纳米颗粒的制造方法，包括以下制造方法制造的锡或锡合金纳米粒子： ：在超声波槽（a）中制备基础液的步骤; 将前体和表面活性剂置于基础液体（b）中的步骤; 放置还原剂（c）的步骤; 施加超声波能量的步骤（d）; 和回收纳米颗粒的步骤。 根据如上所述的用于制造焊锡和锡合金用锡的纳米颗粒的方法，本发明可以防止PCB板在包括SOP工艺，倒装芯片接合工艺，TSV工艺和回流焊接工艺的回流工艺中变形 因为制造的锡或锡合金的熔点低。 （附图标记）（S10）在超声波槽中准备基础液; （S20）将前体和表面活性剂置于基础液中; （S30）放下还原剂; （S40）应用超声波能量; （S50）制造锡纳米颗粒