公开(公告)号：EP3138130A1

公开(公告)日：2017-03-08

申请号：EP15785573.5

申请日：2015-04-17

Applicant: 1366 Technologies Inc.

Inventor： SACHS, Emanuel M. ,  JONCZYK, Ralf ,  LORENZ, Adam L. ,  WALLACE, Richard L. ,  HUDELSON, G. D. Stephen

IPC: H01L31/0236

CPC classification number: C30B11/02 ,  C30B29/06 ,  H01L29/0657 ,  H01L31/022441 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: Semi-conductor wafers with thin and thicker regions at controlled locations may be for Photovoltaics. The interior may be less than 180 microns or thinner, to 50 microns, with a thicker portion, at 180 - 250 microns. Thin wafers have higher efficiency. A thicker perimeter provides handling strength. Thicker stripes, landings and islands are for metallization coupling. Wafers may be made directly from a melt upon a template with regions of different heat extraction propensity arranged to correspond to locations of relative thicknesses. Interstitial oxygen is less than 6 x 10
17 atoms/cc, preferably less than 2 x 10
17 , total oxygen less than 8. 75 x 10
17 atoms/cc, preferably less than 5. 25 x 10
17 . Thicker regions form adjacent template regions having relatively higher heat extraction propensity; thinner regions adjacent regions with lesser extraction propensity. Thicker template regions have higher extraction propensity. Functional materials upon the template also have differing extraction propensities.

Abstract translation: 与在受控的位置和薄较厚的区域半导体晶片可以是用于光伏。 内部可小于180微米或更薄，至50微米，具有较厚的部分，在180-250微米。 薄晶片具有更高的效率。 较厚的周边提供了操作强度。 较厚的条纹，着陆和岛屿是用于金属化耦合。 晶片可以由熔体直接在与布置为对应于相对厚度的位置处的不同的热提取倾向的区域的模板来制备。 填隙氧小于6×10 17原子/ cc，优选小于2×1017，总氧小于8.75×1017原子/ cc，优选小于5.25×第一千〇十七 较厚的区域形成具有相对较高的热提取倾向模板相邻区域; 较薄的区域相邻的区域具有较小的倾向萃取。 较厚的模板区域有较高的倾向提取。 在模板功能材料alsohave不同的提取倾向。

公开(公告)号：EP2766130B1

公开(公告)日：2020-07-08

申请号：EP12840425.8

申请日：2012-10-12

Applicant: 1366 Technologies Inc.

Inventor： DANNER, Guy M. ,  GATES, Holly G. ,  TARASOV, Vladimir S. ,  KANE, Peter E. ,  MADDEN, Peter G. ,  SACHS, Emanuel M.

IPC: B82Y10/00 ,  B82Y40/00 ,  G03F7/00 ,  H01L21/67 ,  H01L21/677 ,  B05D1/04 ,  C21D1/70 ,  C22F1/00 ,  C23C26/00 ,  H01B3/02 ,  H01J9/02 ,  H01J9/18

公开(公告)号：EP2766130A2

公开(公告)日：2014-08-20

申请号：EP12840425.8

申请日：2012-10-12

Applicant: 1366 Technologies Inc.

Inventor： DANNER, Guy M. ,  GATES, Holly G. ,  TARASOV, Vladimir S. ,  KANE, Peter E. ,  MADDEN, Peter G. ,  SACHS, Emanuel M.

IPC: B05D1/06

Abstract: The present inventions relate to the formation of a thin polymer film on a substrate. Apparatus is described for transforming a solid polymer resist into an aerosol of small particles, electrostatically charging and depositing the particles onto a substrate, and flowing the particles into a continuous layer. Apparatus is further described for transforming solid resist into an aerosol of small particles by heating the resist to form a low viscosity liquid such as is compatible with nebulization and applying the techniques of jet or impact nebulization and aerosol particle sizing to form the aerosol. A method is further described of using ionized gas to confer charge onto the aerosol particles and using a progression of charging devices establish an electric field directing the flow of charged particles to the substrate. The progression of charging devices and associated apparatus results in high collection efficiency for the aerosol particles.