公开(公告)号：US20180172504A1

公开(公告)日：2018-06-21

申请号：US15843883

申请日：2017-12-15

Applicant: 3D PLUS

Inventor： Didier GAMBART

IPC: G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0219 ,  G01J1/0204 ,  G01J1/0252 ,  G01J1/0271 ,  G01J1/42 ,  H01L27/14618 ,  H01L27/14683 ,  H04N5/2257

Abstract: A 3D imaging optoelectronic module intended to be fixed to an image-forming device comprises: an optoelectronic sensor comprising a package with a chip electrically connected to a stack of at least one printed circuit board, the sensor and stack assembly moulded in a resin and having faces according to Z with electrical interconnection tracks of the printed circuit boards. It comprises a thermally conductive rigid cradle in the form of a frame having a reference surface according to X, Y and: on a top surface: reference points intended to centre and align the image-forming device in relation to the reference surface, fixing points to allow the fixing of the image-forming device, and an inner bearing surface having bearing points of the sensor adjusted to centre and align the chip in relation to the reference surface.