公开(公告)号：US20160247750A1

公开(公告)日：2016-08-25

申请号：US15046277

申请日：2016-02-17

Applicant: 3D PLUS

Inventor： Alexandre VAL ,  Fabrice SOUFFLET

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064

Abstract: A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180° the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be moulded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection tabs so as to superpose the exterior tabs on the internal portion; moulding, in a resin, the stack, the exterior tabs and the internal portion and thereby partially covering the upper protective element; cutting the resin and thereby leaving flush conductive sections of the exterior tabs and of the ends of the leads and removing the resin from the upper protective element; metallizing the cut faces; removing the carrier; and removing the protective elements in order to expose the leads of the external portion.

Abstract translation: 一种用于制造至少一个3D电子模块的方法各自包括电子封装和/或印刷线路板堆叠，其中堆叠被放置在电连接系统上，该电互连系统包括各自具有两端的金属引线。 该方法包括以下步骤：从包括金属引线的引线框开始，将引线折叠约180°，以获得包括要成型的包括折叠端部的内部框架部分， 其它部分，其被称为外部部分，包括展开的外端，每个引线的两端旨在从沿着Z切割的给定面上的3D模块露出; 在引线上沉积金属涂层; 将框架的外部部分放置在两个上部和下部保护元件之间，同时使内部部分自由，并将框架和保护元件放置在托架上; 将每个堆叠的每个堆叠设置有外部互连突片，以便将外部突出部叠置在内部部分上; 在树脂中成型，堆叠，外部突片和内部部分，从而部分地覆盖上部保护元件; 切割树脂，从而留下外部突片和引线的端部的平齐的导电部分，并从上保护元件移除树脂; 金属化切割面; 移除载体; 并且去除保护元件以暴露外部部分的引线。