公开(公告)号：AU2023276802A1

公开(公告)日：2024-12-05

申请号：AU2023276802

申请日：2023-05-15

Applicant: 3D PLUS

Inventor： LE BLAY PIERRE

IPC: H01L27/146 ,  H01L31/0203

Abstract: The invention relates to a heat sink (40) made from a thermally conducting material and intended for thermally connecting an optoelectronic sensor (10) to a rigid cradle (30) cooled by external cooling means; the optoelectronic sensor (10) being mounted on a printed circuit (20); the cradle having at least one fixing boss (32) and an opening (31) intended to house the optoelectronic sensor (10); said heat sink (40) comprising: - a base (41) intended to be placed in thermal contact with at least one fixing boss (32) of the cradle; - a protuberance (42) intended to be placed in thermal contact with an underside face of the optoelectronic sensor (10) through a hole passing through the printed circuit (20).