公开(公告)号：US20200003826A1

公开(公告)日：2020-01-02

申请号：US16455595

申请日：2019-06-27

Applicant: 3D PLUS

Inventor： Mohamed BOUSSADIA

IPC: G01R31/28

Abstract: An apparatus for burning in electronic components, which includes a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components and a burn-in driver. The holder is at room temperature, and each assembly comprises a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed. The printed circuit board forming one wall of the chamber, the burn-in driver is soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprises means for dissipating only the thermal energy of operation of the burn-in driver.