公开(公告)号：DE602005009638D1

公开(公告)日：2008-10-23

申请号：DE602005009638

申请日：2005-12-02

Applicant: 3D SYSTEMS INC

Inventor： CHUNG TAE MARK ,  BISHOP RAYMOND J ,  GEVING BRADLEY DAVID ,  FONG JON JODY ,  DUNNE PATRICK

IPC: B22F3/105 ,  B22F3/11 ,  B29C35/16 ,  B29C67/00

Abstract: The invention is a method for controllably cooling at least a portion of a part-cake from a laser sintering system to minimize cool down time, maximize throughput, and minimize thermal gradients within the part-cake. The method generally comprises forming one or more thermal transfer channels within the part-cake. The thermal transfer channels can include ducts and cooling fins in the part-cake surrounding the formed part. The method can further comprise removing unfused powder from the ducts and introducing cooling media into the ducts. The invention also includes a part-cake having thermal transfer channels formed therein and a laser sintering apparatus comprising a part-cake containing cylinder having permanent fittings therein for receiving terminal portions of thermal transfer channels formed in the part-cake.