HIGH BRIGHTNESS LED PACKAGE
    1.
    发明申请
    HIGH BRIGHTNESS LED PACKAGE 审中-公开
    高亮度LED包装

    公开(公告)号:WO2006049746A1

    公开(公告)日:2006-05-11

    申请号:PCT/US2005/034555

    申请日:2005-09-27

    CPC classification number: H01L33/58 H01L33/54 H01L33/60

    Abstract: Light sources are disclosed utilizing LED dies that have a light emitting surface. A patterned low refractive index layer that can support total internal reflection within the LED die is provided in optical contact with a first portion of the emitting surface. In optical contact with a second portion of the emitting surface is an input surface of an optical element. The refractive index of the low index layer is below both that of the optical element and the LED die. The optical element can have a variety of shapes and sizes.

    Abstract translation: 利用具有发光表面的LED管芯来公开光源。 提供可以支持LED管芯内的全内反射的图案化低折射率层与发射表面的第一部分光学接触地提供。 在与发光表面的第二部分的光学接触中是光学元件的输入表面。 低折射率层的折射率低于光学元件和LED管芯的折射率。 光学元件可以具有各种形状和尺寸。

Patent Agency Ranking