公开(公告)号：US20170210950A1

公开(公告)日：2017-07-27

申请号：US15316610

申请日：2015-07-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan Heimink ,  Kerstin Unverhau ,  Andreas Backes ,  Adrian T. Jung ,  Dirk Hasenberg

IPC: C09J7/02 ,  C08J5/06

CPC classification number: C08J5/06 ,  C09J7/26 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2433/006

Abstract: The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa.s to 80,000 Pa.s, when measured at 120C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

公开(公告)号：US20200062912A1

公开(公告)日：2020-02-27

申请号：US16670647

申请日：2019-10-31

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan Heimink ,  Kerstin Unverhau ,  Andreas Backes ,  Adrian T. Jung ,  Dirk Hasenberg

IPC: C08J5/06 ,  C09J7/26

Abstract: The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa·s to 80,000 Pa·s, when measured at 120° C. according to the test method described in the experimental section.The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

公开(公告)号：US11879078B2

公开(公告)日：2024-01-23

申请号：US17281104

申请日：2019-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adrian T. Jung ,  Boris Tasch ,  Dirk Hasenberg ,  Olaf Ludewig ,  Elisabeth Cura

IPC: C09J5/06 ,  C08G59/50 ,  C08G65/20 ,  C08G65/333 ,  C08K5/00 ,  C09J9/00

CPC classification number: C09J5/06 ,  C08G59/50 ,  C08G65/20 ,  C08G65/33317 ,  C08K5/0025 ,  C09J9/00

Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.

公开(公告)号：US11198802B1

公开(公告)日：2021-12-14

申请号：US17297173

申请日：2019-12-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adrian T. Jung ,  Mareike Bardts ,  Dirk Hasenberg

IPC: C09J163/00 ,  C08G59/24 ,  C08G59/54 ,  C08G59/50 ,  C08G59/56 ,  C09J9/00 ,  C09J5/06 ,  C08K5/00 ,  C08L63/00

Abstract: The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

公开(公告)号：US20230235204A1

公开(公告)日：2023-07-27

申请号：US17927325

申请日：2021-05-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adrian T. Jung ,  Boris Ove Alexander Tasch ,  Elisabeth Cura ,  Eike H. Klünker ,  Peter Bissinger ,  Wolf Steiger ,  Dirk Hasenberg

IPC: C09J163/00

CPC classification number: C09J163/00

Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.