公开(公告)号：US20200029443A1

公开(公告)日：2020-01-23

申请号：US16155468

申请日：2017-04-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John D. Le ,  Moses M. David ,  Jeffrey W. McCutcheon ,  Hung T. Tran

IPC: H05K3/04 ,  H05K3/00

Abstract: Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.