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    POSITION DETECTION SYSTEM, POSITION DETECTION METHOD, ANGLE DETECTION METHOD, AND MARKER
    2.
    发明申请
    POSITION DETECTION SYSTEM, POSITION DETECTION METHOD, ANGLE DETECTION METHOD, AND MARKER 审中-公开

    公开(公告)号：WO2020121092A1

    公开(公告)日：2020-06-18

    申请号：PCT/IB2019/060133

    申请日：2019-11-25

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： IWASAWA, Masaru

    IPC: G01S17/74 ,  G02B5/12

    Abstract: To provide a position detection system, a position detection method, an angle detection method, and a marker that enable detection of a position, adjustment of a position, detection of an angle, and the like of a movable body with respect to a stationary body to be easily performed. Means for solving problem: A position detection system is a position detection system for detecting a position of a movable body moving with respect to a stationary body, the position detection system including a light source provided in one of the stationary body and the movable body, an imaging unit provided in one of the stationary body and the movable body, a marker provided in the other of the stationary body and the movable body, and a position detecting unit configured to detect a position of the movable body with respect to the stationary body based on luminance of an image of the marker acquired by the imaging unit, wherein the marker includes a reflective layer, and a light control layer provided in the reflective layer, and the light control layer transmits light having an angle of incidence with respect to the main surface being within a predetermined threshold value.

    LIGHT-EMITTING ELEMENT MODULE
    3.
    发明申请
    LIGHT-EMITTING ELEMENT MODULE 审中-公开
    发光元件模块

    公开(公告)号：WO2015112680A1

    公开(公告)日：2015-07-30

    申请号：PCT/US2015/012400

    申请日：2015-01-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： IWASAWA, Masaru ,  OSAWA, Tomofumi ,  DAIGO, Yasuyuki ,  FURUSAWA, Masaaki ,  YAMASAKI, Taiji ,  AKUTAGAWA, Satoshi

    IPC: F21S2/00

    CPC classification number: F21V5/04 ,  F21V11/00 ,  F21V17/06 ,  F21V17/12 ,  F21V31/005 ,  F21Y2115/10

    Abstract: A light-emitting element module (1) is provided with: a light-emitting element (11) that generates a light, a substrate (12) on which the light-emitting element (11) is mounted, a lens member (28) that is disposed on a mounting surface (12a) side of the substrate (12) and is at least provided with a light control unit (13), and a light absorption unit (19) that absorbs a light. The light absorption unit (19) is configured by a member disposed between the substrate (12) and the lens member (28).

    Abstract translation: 发光元件模块（1）具有：发光元件（11），安装有发光元件（11）的基板（12），透镜部件（28） 其设置在所述基板（12）的安装面（12a）侧，并且至少设置有光控制单元（13）和吸收光的光吸收单元（19）。 光吸收单元（19）由设置在基板（12）和透镜构件（28）之间的构件构成。

    LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY
    4.
    发明申请
    LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY 审中-公开
    使用层压体制造超薄衬底的层压体，方法和装置

    公开(公告)号：WO2004006296A2

    公开(公告)日：2004-01-15

    申请号：PCT/US2003/017236

    申请日：2003-06-02

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  NODA, Kazuki ,  IWASAWA, Masaru

    Inventor： NODA, Kazuki ,  IWASAWA, Masaru

    IPC: H01L

    CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

    Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    Abstract translation: 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底被研磨成非常小的厚度，然后可以与支撑体分离而不损坏基底。 本发明的一个实施方案是一种层叠体，其包括待研磨的基材，与待研磨基材接触的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，通过透光层照射层叠体，分解光电转换层，分离基板和透光支撑体。

    DETECTION MEMBER, INSULATOR, AND DETECTION METHOD
    5.
    发明申请
    DETECTION MEMBER, INSULATOR, AND DETECTION METHOD 审中-公开

    公开(公告)号：WO2019197947A1

    公开(公告)日：2019-10-17

    申请号：PCT/IB2019/052756

    申请日：2019-04-04

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： IWASAWA, Masaru

    IPC: G01N17/00

    Abstract: Object: To provide a detection member, an insulator, and a detection method that can previously detect narrowing of a pin of the insulator. Solving Means: A detection member according to an embodiment is a detection member 10 for detecting narrowing of a pin 8 of an insulator 5, and the detection member includes a contact portion that is in contact with the pin 8, an outer circumferential portion provided in at least a part of a circumference of the pin 8 via the contact portion, and a reflective fluorescence portion 11 provided in at least a part of the outer circumferential portion.

    LIGHT EMITTING ELEMENT MODULE
    7.
    发明申请
    LIGHT EMITTING ELEMENT MODULE 审中-公开
    发光元件模块

    公开(公告)号：WO2015021038A1

    公开(公告)日：2015-02-12

    申请号：PCT/US2014/049765

    申请日：2014-08-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： IWASAWA, Masaru ,  DAIGO, Yasuyuki ,  YAMASAKI, Taiji ,  AKUTAGAWA, Satoshi ,  OSAWA, Tomofumi

    IPC: F21V31/00 ,  F21V25/00

    CPC classification number: F21V31/00 ,  F21K9/00 ,  F21S4/10 ,  F21V5/04 ,  F21V19/0055 ,  F21V31/005 ,  F21Y2115/10

    Abstract: A light emitting element module comprises a light emitting element for generating a light, a substrate on which the light emitting element is mounted, a light controller disposed on a mounting surface side of the substrate to control emission of light generated by the light emitting element, a sealing section disposed on the mounting surface side of the substrate so as to surround at least the light emitting element when viewed from a vertical direction relative to the mounting surface and a pressing structure that imparts a pressing force to the sealing section. The sealing section seals a space between, at least, the substrate and the light controller, on an inner circumferential side of the sealing section by the pressing force.

    Abstract translation: 发光元件模块包括用于产生光的发光元件，安装有发光元件的基板，设置在基板的安装表面侧的光控制器，以控制由发光元件产生的光的发射， 当从垂直方向相对于安装表面观察时，设置在基板的安装表面侧上的至少包围发光元件的密封部分和向密封部分施加压力的按压结构。 密封部分通过按压力在密封部分的内周侧上密封至少基板和光控制器之间的空间。

    PRODUCTION METHOD OF SEMICONDUCTOR CHIP
    8.
    发明申请
    PRODUCTION METHOD OF SEMICONDUCTOR CHIP 审中-公开
    半导体芯片的生产方法

    公开(公告)号：WO2005057651A1

    公开(公告)日：2005-06-23

    申请号：PCT/US2004/034662

    申请日：2004-10-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  NODA, Kazuki ,  IWASAWA, Masaru

    Inventor： NODA, Kazuki ,  IWASAWA, Masaru

    IPC: H01L21/78

    CPC classification number: H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2924/3025

    Abstract: Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting support; and optionally removing the adhesive layer from the semiconductor chips.

    Abstract translation: 本发明提供一种半导体芯片的制造方法，其特征在于，在透光性支承体上涂敷光热转换层，只要在辐射能量照射下，光热转换层将辐射能量转化成热量，由于热而分解; 通过将电路面和光热转换层相对地相对地将半导体晶片和透光性支持体层叠在光固化性粘合剂上，从而在外部形成具有非电路面的层叠体; 研磨半导体晶片的非电路面，直到半导体晶片达到期望的厚度; 从非电路面侧切割接地半导体晶片，将其切割成多个半导体芯片; 照射来自透光性支持侧的照射能量以分解光热转换层，从而分离成具有粘合剂层的半导体芯片和透光性支撑体; 并且可选地从半导体芯片去除粘合剂层。

    PRODUCTION METHOD OF SEMICONDUCTOR CHIP
    10.
    发明公开
    PRODUCTION METHOD OF SEMICONDUCTOR CHIP 有权
    法半导体芯片

    公开(公告)号：EP1690292A1

    公开(公告)日：2006-08-16

    申请号：EP04795777.4

    申请日：2004-10-20

    Applicant: 3M Innovative Properties Company

    Inventor： NODA, Kazuki ,  IWASAWA, Masaru

    IPC: H01L21/78 ,  H01L21/68

    CPC classification number: H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2924/3025

    Abstract: Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting support; and optionally removing the adhesive layer from the semiconductor chips.

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