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公开(公告)号：US11503720B2
公开(公告)日：2022-11-15
申请号：US17270912
申请日：2019-09-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Saagar Shah , Mikhail L. Pekurovsky , Ankit Mahajan , Lyudmila A. Pekurovsky , Jessica Chiu , Jeremy K. Larsen , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Richard J. Pokorny , Benjamin R. Coonce , Chad M. Amb , Thomas P. Klun
Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.
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公开(公告)号：US20210212216A1
公开(公告)日：2021-07-08
申请号：US17270912
申请日：2019-09-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Saagar Shah , Mikhail L. Pekurovsky , Ankit Mahajan , Lyudmila A. Pekurovsky , Jessica Chiu , Jeremy K. Larsen , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Richard J. Pokorny , Benjamin R. Coonce , Chad M. Amb , Thomas P. Klun
Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.
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公开(公告)号：US12205882B2
公开(公告)日：2025-01-21
申请号：US17754028
申请日：2020-09-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
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公开(公告)号：US20210280337A1
公开(公告)日：2021-09-09
申请号：US16948540
申请日：2020-09-23
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, JR. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC: H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
Abstract: A stretchable conductor includes a substrate with a first major surface, wherein the substrate is an elastomeric material. An elongate wire is on the first major surface of the substrate; the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Composite articles including a stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US10971468B2
公开(公告)日：2021-04-06
申请号：US16461015
申请日：2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gilman , Shawn C. Dodds , Thomas J. Metzler , Matthew R. D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00 , H01L23/498 , B81C3/00 , H01L23/544
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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Patent Agency Ranking
公开(公告)号：US10854355B2
公开(公告)日：2020-12-01
申请号：US16621021
申请日：2018-06-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan, Jr. , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC: H01K3/10 , H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
Abstract: A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US20220367325A1
公开(公告)日：2022-11-17
申请号：US17754028
申请日：2020-09-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
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公开(公告)号：US20210035875A1
公开(公告)日：2021-02-04
申请号：US16976126
申请日：2019-02-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Saagar A. Shah , Thomas J. Metzler , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen
IPC: H01L23/16 , H01L23/31 , H01L23/544 , H01L23/498 , H01L21/56 , H01L21/54
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.
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公开(公告)号：US20190273061A1
公开(公告)日：2019-09-05
申请号：US16461015
申请日：2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gillman , Shawn C. Dodds , Thomas J. Metzler , Matthew R.D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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10.发明申请公开(公告)号：US20190135991A1
公开(公告)日：2019-05-09
申请号：US16095184
申请日：2017-04-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ying Lin , Hassan Sahouani , Mary M. Caruso Dailey , Luke E. Heinzen , Michael A. Kropp , Patricia M. Savu , Jonathan W. Kemling , Wayne S. Mahoney
CPC classification number: C08J3/241 , C08G59/40 , C08J3/126 , C08J9/365 , C08J2333/14 , C08J2333/16 , C08J2363/00 , C08J2433/10 , C08J2433/16 , C08K9/10 , C08L33/10 , C08L33/16 , C08L63/00 , C08L2207/53 , C09D133/16
Abstract: Composite particles are provided that can be used to cure epoxy resins. More particularly, the composite particles have a porous polymeric core particle, a curing agent and/or a curing catalyst for an epoxy resin positioned within the porous polymeric core particle, and a fluoropolymer-containing coating layer around the porous polymeric core particle. Additionally, curable compositions are provided that are mixtures containing an epoxy resin and the composite particles. The epoxy resin typically does not react until the curable composition is heated causing the release of the curing agent and/or curing catalyst from the composite particle. Further, cured compositions formed from the curable composition are provided.
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