公开(公告)号：US20240239991A1

公开(公告)日：2024-07-18

申请号：US18014783

申请日：2021-07-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jacob P. Podkaminer ,  Matthew H. Frey ,  Victor Ho ,  Matthew T. Johnson ,  Jeremy K. Larsen ,  Craig W. Lindsay ,  Kyle C. Picha ,  Mario A. Perez

IPC: C08K7/00 ,  C08L33/02 ,  C09K5/14

CPC classification number: C08K7/00 ,  C09K5/14 ,  C08K2201/001 ,  C08L33/02

Abstract: A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.